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VOLUME 24-NUMBER 5  Search :     Wednesday, March 10, 2010      May, 2008
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Hynix, Samsung ready three-bit-per-cell NAND
By Mark LaPedus, EE Times
SAN JOSE, Calif. -- Two Korean memory vendors--Hynix Semiconductor Inc. and Samsung Electronics Co. Ltd.--are separately gearing up for a push into the three-bit-per-cell NAND flash race. On Tuesday (June 4), Hynix developed a 32-gigabyte NAND flash memory using three-bit-per-cell technology, according to a report from Chosun Ilbo. 

''We were surprised to hear from one of our contacts that Samsung is to begin production of 3-bit per cell NAND at the end of 2008,'' said Daniel Amir, an analyst at Lazard Capital Markets, in a recent report.

''Up until now, this technology has been the highlight of the SanDisk story, as that company--with Toshiba--are the only ones that have this technology,'' he said. ''However, Samsung's attempt to produce 3-bit per cell NAND puts a challenge to SanDisk's IP claim on this technology. While we do not know how this could play out, we see this data point as potentially negative for SanDisk.''

   









 
 
 
Features & Highlights

Special Feature: Test and Measurement

Electronic Mfg. Services

Electronic Mfg. Products

Product Preview: EDS

New Products

Business News

Automation Key to Quality Coax Cable Assembly


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Fast-Track Growth at RAD Electronics


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EAO: Switches for Broadcasters and Studios

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PI Adds Piezo Nanopositioning Stages

Auburn, MA β€” PI (Physik Instrumente) L.P. has extended its PIHera® family of flexure-guided piezo nanopositioning stages, now offering record travel ranges to 1.8mm. The precision closed-loop flexure-guided stages can be used for scanning probe applications (surface metrology) and...

Endicott & Unimicron in Sales & Manufacturing Agreement

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Tech-Op-Ed
No Moving Parts
China Trade Shows: Busier than Ever
Tech Watch
This 2-Pound Computer Does it All (Almost)
People in the News
ASC Hires Bill Neuenfeldt for Southeast US & European Sales
CAO Group Names Dr. Gary Maag GM of Optoelectronics
Steven Ratner Joins Heraeus Contact Materials Division as Regional Sales Engineer
Business News
Coleman Cable to Expand Distribution Facility
Owens Design Expands Solar Industry Support
Tapecon Announces ITAR Registration.
Endicott & Unimicron in Sales & Manufacturing Agreement
Adhesive Packaging & Cartridge Application Form Joint Venture
Management
Adapting for Success in the PCB Industry
Electronic Mfg. Services
Fast-Track Growth at RAD Electronics
Using Negative-Stiffness Vibration Isolators
Production
Lean, Mean and ESD-Free Workstations
Electronic Mfg. Products
Agilent: AOI System Can Inspect Paste
Asymtek Intros Microelectronics Dispensing Solutions
Cobar: Bar Solder, Wire, SN100C Alloys
Digitaltest Upgrades Flying Prober & Compatibility Software
Samsung: TurnKey SMT Line Increases Productivity
Partnering
Tester Helps Airbase Services Keep Airlines Flying
Distribution
Allied to Distribute Quest's Lightstar Product Line
All American Semiconductor & Tyco Renew Disty Pact
Digi-Key Now Stocking SiC RF Power MESFETs from Cree
Product Preview: EDS
Advanced Interconnections: Nonlinear Peel-A-Way® Patterns
Brady Intros Precise Label Applicator
Dry 100°C HID Caps from Cornell Dubilier
EAO: Switches for Broadcasters and Studios
New Products
Astrodyne: 225W Switching Power Supplies
Custom Connector Designs from Autosplice
Binder Intros Submin Push-pull Connectors
Hi-Tech Events
IEEE SECON Conference in San Francisco
Autotestcon Scheduled for Salt Lake City
Photovoltaics 2008 Headed for Denver
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