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Thursday, May 24, 2018
VOLUME -23 NUMBER 7
Publication Date: 07/1/2008
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Feature: Assembly and Packaging
Product Preview: Semicon West
July 2008 Issue
Front Page News
Quantum Logic Clock Most Accurate Yet
Gaithersburg, MD — An atomic clock that uses an aluminum atom to apply the logic of computers to the peculiarities of the quantum world now rivals the world's most accurate clock, based on a single mercury atom. Both clocks are at least 10 times more accurate than the current U.S. time standard. The measurements, described in a new paper, were made in a yearlong comparison of the two next-generation clocks, both designed and built at the National Institute of Standards and Technology (NIST).
Ericsson, STMicroelectronics form joint venture
Swedish wireless equipment maker LM Ericsson AB and Swiss chip-maker STMicroelectronics NV unveiled plans Wednesday to create a 50-50 joint venture that will make a key component known as chipsets for mobile phones.
Indium Corporation Expert to Present at PCIM Europe
CLINTON, NY -
expert, Karthik Vijay, Technical Manager, Europe, Africa, and the Middle East, will present at
on Wednesday, June 6, in Nuremberg, Germany.
Vijay will present Improve Reliability and Bondline Control with InFORMS® and Indalloy®276.
SEMICON WEST Adds WT | Wearable Technologies Conference Co-Location: Premier U.S. electronics manufacturing event expands with wearables program
MILPITAS, CA - SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco.
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.
Atotech to present Spherolyte® CU UF3 for fine line RDL at ECTC 2018
BERLIN, GERMANY -
is pleased to announce its partaking in the Electronics Components and Technology Conference (ECTC) 2018. As a gold sponsor, Atotech will participate with two presentations and a booth, highlighting its latest solutions for flexible electronics as well as fan-out wafer-level and fan-out panel-level packaging.
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