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Publication Date: 07/1/2008
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Indium Corp: No-Clean Pb-Free Solder Paste
Lead-free no-clean solder paste.
Clinton, NY — Newly introduced Indium8.9 Pb-Free No-Clean Solder Paste is an air reflow solder paste that performs like SnPb by delivering more performance features than any Pb-Free solder paste ever made. As CSP, 0201, and 01005 technology is becoming more mainstream, PC board assemblers are challenged with achieving high solder paste transfer efficiency through small stencil apertures.

Indium8.9 was formulated to produce consistent print volumes through apertures below the industry recommended minimum area ratio of 0.66. From cell phones to Mother Boards — the new paste does it all, exhibiting low voiding (<5 percent) over many different profiles when soldering BGAs with via-in-pad technology. It also offers a very robust processing window that can minimize potential defects, as well as accommodate various board sizes and throughput requirements.

The new paste was specially designed to improve first-pass yields and reduce field failures when mounting BGA devices by eliminating "head-in-pillow" defects. It also offers the benefit of being extremely thermally stable and maintaining a soft, pliable residue after reflow. This means easier probe-testability and fewer false rejects during in-circuit testing.

According to the company, the performance benefits customers obtain by using Indium8.9 result in increased cost savings and the highest finished goods reliability.

Contact: Indium Corp., 34 Robinson Road, Clinton, NY 13323 315-853-4900 fax: 315-853-1000 E-mail: Web:

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