Sunday, May 28, 2017
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Henkel Releases Epoxy Flux and Underfill

Irvine, CA — Henkel's breakthrough epoxy flux material, Hysol FF6000, combines flux functionality and underfill protection into a single material. A reflow curable material, Hysol FF6000 has been formulated to provide fluxing action for lead-free solder joint formation and, when cured, delivers underfill-like ...
 
 
 
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