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Wednesday, July 27, 2016
VOLUME -23 NUMBER 8
Publication Date: 08/1/2008
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Electronic Mfg. Services
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Special Feature: Test and Measurement
Product Preview: ATExpo/IPC-MW
August 2008 Issue
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ISI Adapters Solve IC Obsolescence
IC package adapter.
Camarillo, CA — Interconnect Systems, Inc. has developed a new interconnect system called FlexFrame
to enable footprint conversion adapters for obsolescent SMT gullwing and j-lead packages such as QFPs, PLCCs, TSOPs, and SOICs. The new adapter consists of PhosBronze pins which are loaded into an FR4 carrier and bent to shape to emulate the gullwing or j-leads on the IC package.
The FlexFrame connector is soldered between the adapter and host PC board to create a rugged, reliable interconnect. The adapter is named for its flexible configuration options including unique pin location and pitch, various standoff heights, and windows in the carrier that allow components to be placed in the center of the interconnect on the bottom of the adapter.
According to the company, IC obsolescence is a growing issue, and it is currently designing 2 to 3 new products each week to deal with this problem.. The company's focus is on cost-effective solutions that can be utilized in ongoing production. Our modules and adapters have been qualified for use in high reliability applications including Military, Aerospace, Telecom, Networking, Server and Industrial markets.
Contact: Interconnect Systems, Inc., 759 Flynn Road, Camarillo, CA 93012
805-482-2870 fax: 805-482-8470 Web:
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