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Monday, February 27, 2017
VOLUME -23 NUMBER 9
Publication Date: 09/1/2008
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Feature: PCB and Assembly
Product Preview: ATExpo/IPC-MW
September 2008 Issue
Front Page News
Wind Farms Proliferating Worldwide
By Tom Adams
Wind farms, one of the most viable candidates to replace parts of our oil-dependent technologies, are growing in numbers in the U.S., and have the potential to become more efficient than they are today. One of the newest is a modest farm of five 1.5 megawatt wind turbines located in Atlantic ...
New 2-Pin JTAG Standard Coming
Houston, TX — As chips add new functionality and system designs evolve away from boards and toward multi-chip system-on-chip (SoC) architectures, developers of handheld and consumer electronics are faced with stricter pin and package constraints. Texas Instruments, Inc. (TI) (NYSE: TXN), a key member of the IEEE ...
2011: The Year of the OLED
By Harry Zervos, Technical Consultant, IDTechEx
Will 2011 be the year of the OLED? Recent announcements from major developers of organic electroluminescence (OLED) technology seem to indicate that 2011 will be the year that the first commercial OLED lighting applications will appear on the market. Prototypes have been demonstrated by several companies ...
Dr. Nebioglu of Dymax Corporation Presented Her Research at the IPC/ APEX Expo
TORRINGTON, CT - Dymax Corporation is proud of the participation of its Senior R&D Manager of the Adhesives team, Dr. Aysegul Kascatan Nebioglu at the IPC/ APEX Expo 2017 that took place on February 14 to 17 in San Diego, California.
Indium Corporation’s Durham to Share Expertise at IMAPS Device Packaging
CLINTON, NY - Indium Corporation’s
, Technical Support Engineer for Semiconductor and Advanced Assembly Materials, will share her expertise at IMAPS
13th International Conference and Exhibition on Device Packaging
on March 7-9 in Fountain Hills, Ariz.
3D Glass Solutions Announces Highest Efficiency 5G IPD RF Filters
ALBUQUERQUE, N.M. - 3D Glass Solutions, Inc. (3DGS), a world-class expert on the fabrication of electronic packages and devices using photo-definable glass-ceramics, announced today the development and production of the highest efficiency 5G integrated passive devices (IPD) for radio frequency (RF) filters. These RF filters have been designed to operate as bandpass filters for frequencies at 5GHz and 28GHz with less than 1.0 dB of insertion loss.
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