Sunday, April 22, 2018
VOLUME -23 NUMBER 12
Publication Date: 12/1/2008
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Archive >  December 2008 Issue >  Front Page News > 
Cold Atoms in Focused Ion Beams to Replace Hot Gallium

Gaithersburg, MD — Scientists at the National Institute of Standards and Technology (NIST) have developed a radical new method of focusing a stream of ions into a point as small as one nanometer. Because of the versatility of their approach — it can be used with a wide range of ions tailored to
the task at hand — it is expected to have broad application in nanotech... Read More
Innovation in Danger: Engineering Students Down Worldwide

Piscataway, NJ — The trend is alarming, and it's global. In Western Europe, Australia, Japan and even in India, the numbers of students attracted to engineering and computer science are declining. For example, a 2003 Harris poll conducted in the U.S. shows that only two percent of first year university students ...Read More
Wireless Sensor Networks Get Priority R&D


Technology will soon make it possible to automatically monitor and respond to such events as forest fires, avalanches, hurricanes, faults in country wide utility equipment, traffic, hospitals and much more over wide areas and with billions of sensors. It will become possible through the use of Wireless ...
Read More


 
 
SMTA Europe's Harsh Environments Conference Session 7 to Focus on Hi-Temp Mats/Fab
SMTA Europe announces Session 7 Technical Program on High Temperature PCB Materials and Fabrication at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.      
EOS WLC550 series offers maximum Cooling Flexibility on Standard Footprint
Last week at the MT-CONNECT in Nuremberg more than 150 companies from the European MedTec Business met for discussing the latest trends and guidelines in MedTec industry. When EOS power presented its medical up to class-2 powersupplies at MT-CONNECT, the EOS team made an exciting observation: While everyone is still talking about the size of the powersupplies, which is still very true for home devices, the real crucial factor for sales support for larger devices at the MT connect was the cooling.   
SEMI and TechSearch International Report Global Semiconductor Packaging Materials Market Reaches $16.7 Billion

MILPITAS, CA SEMI, the industry association representing the global electronics manufacturing supply chain, and TechSearch International today reported that the global semiconductor packaging materials market reached $16.7 billion in 2017. While slower growth of smartphones and personal computers – the industry’s traditional drivers – is reducing material consumption, the slowdown was offset by strong unit growth in the cryptocurrency market in 2017 and early 2018. Flip chip package shipments into the cryptocurrency market, while providing a windfall to many suppliers, are not expected to remain at high levels.  


C&K ANNOUNCES THAT IT HAS ACQUIRED VUILLERMOZ
Newton, MA – C&K, one of the world’s most trusted brands of high-quality electromechanical switches, today announces that it has acquired the company Vuillermoz, a micro-mechanical components and tooling company located in St. Claude, France.



 
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