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Tuesday, October 25, 2016
VOLUME -23 NUMBER 12
Publication Date: 12/1/2008
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Feature: Test and Measurement
Product Preview: Electronic West / MDM
December 2008 Issue
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Fujipoly: Improved Thermal Material
Thermal interface & gap filler pad.
Carteret, NJ — Fujipoly has improved its Sarcon
GR-Fd thermal interface gap filler pad. The unusual gel-like material is manufactured with an integrated nylon mesh layer that prevents distortion and stretching during die-cut operations. The true-to-form gap filler pad is easier to install and increases productivity compared to non-reinforced alternatives.
When placed between a heat source such as a high-performance semiconductor and a nearby heat sink, the thermal pad will transfer heat with a thermal conductivity of 1.5 W/m°K and a thermal resistance ranging between 0.60 and 3.33°C-in.
/W depending on material thickness. flame retardant TIM is available in 9 thicknesses ranging from 0.50 to 5mm in sheets up to 300 x 200mm.
Contact: Fujipoly America Corporation, P.O. Box 119, Carteret, NJ 07008
732-969-0100 fax: 732-969-3311 E-mail: firstname.lastname@example.org Web:
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