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VOLUME -24 NUMBER 2
Publication Date: 02/1/2009
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Electronic Mfg. Services
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Special Feature: Components & Distribution
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February 2009 Issue
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IMAPS Device Packaging Conference in Arizona
Washington, DC — The 5th Annual International Conference and Exhibition on Device Packaging is being held March 9-12, 2009 at the Radisson Fort McDowell Resort & Casino in Scottsdale/Fountain Hills, Arizona. The IMAPS Device Packaging Conference continues to grow. It is the premiere spring conference and exhibition on microelectronics and packaging, held during Arizona's balmiest and pleasantest time of the year.
The technical program continues to expand, now featuring six technical tracks on: 3D Packaging; MEMS; Flip Chip; Wafer Level Packaging; BioMedical Devices; and new in 2009, Power LED Devices. The exhibit hall has sold out for the fourth consecutive year with a growing waiting list. Attendance has grown by 20-50 percent each of the past three years.
The slate of professionals development courses has been expanded so that it now features eight half-day courses. In addition, the Conference will present two panel discussions on: 3D Integration Technologies, Applications and Roadmaps; and Wafer Level Packaging There will also be an interactive poster session.
The Global Business Council (GBC) has again co-located its Spring Conference, March 8-9, focusing on Supply Chain Development for 3D Packaging. There will be several networking receptions and gatherings throughout the week, including a golf outing, the opening reception, meals, and other social events.
Contact: IMAPS, 611 2nd St. N.E., Washington, DC 20002.
202-548-4001; fax: 202-548-6115. Web:
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