Save. Share. Connect.
Thursday, July 20, 2017
VOLUME -24 NUMBER 2
Publication Date: 02/1/2009
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Feature: Components & Distribution
Product Preview: APEX
February 2009 Issue
Product Preview: APEX
Add Message Board
Henkel Intros Self-filleting Die Attach Technology
Capillary action adhesive being automatically applied.
Irvine, CA — Henkel has launched what it describes as breakthrough self-filleting die attach technology with a line of new Ablestik
brand die attach materials known as self-filleting die attach. The new class of die attach products offers all of the benefits of traditional die attach pastes, but takes the adhesive technology further by incorporating a self-filleting mechanism.
The self-filleting mechanism makes the technology a viable and much less costly alternative to die attach films.
Today's device technologies have dictated the need for much thinner die in packages with tighter geometric tolerances. For these applications, conventional die attach pastes can be hard to control, with uniform bondlines and complete wetting becoming more and more difficult to achieve. These challenges are what have created the need for die attach films, which are effective but can cost as much as 50 percent more than traditional die attach pastes.
The new cost-effective alternative to film-based materials is a die attach paste technology that utilizes capillary force to control flow and deliver complete wetting. Unlike conventional die attach materials that rely on complicated, precise dispense patterns in combination with die placement force to encourage flow, determine bondline thickness and promote wetting, Ablestik brand self-filleting pastes use capillary function to control these critical process parameters through dispense volume and spacer technology. Employing traditional automatic dispense technology, a dot of the new self-filleting material is deposited and the die gently placed. The capillary force of the material then draws it out to the edge of the die where it forms a small fillet. No excessive placement force is required, which eliminates die damage while also allowing for extremely tight process control.
The materials are currently available in three formulations: Ablestik AAA3300
non-conductive paste for die to substrate laminate-based devices; Ablestik AAA3320
non-conductive material for die to die attachment, including same size, pyramidal and orthogonal die stack packages, and; Ablestik 3900
conductive adhesive designed for die-to-substrate leadframe packages.
Contact: Henkel Corporation, 1001 Trout Brook Crossing, Rocky Hill, CT 06067
See at APEX Booth #645 and MDM/Pacific Design/Electronics West Booths #321, 2326.
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | firstname.lastname@example.org
powered by GIM