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VOLUME -24 NUMBER 2
Publication Date: 02/1/2009
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Feature: Components & Distribution
Product Preview: APEX
February 2009 Issue
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Muhlbauer High Tech International and Oerlikon Esec Enter Alliance
Roding/Germany and Cham/Switzerland — Muhlbauer High Tech International, a provider of smart card and ID turnkey solutions has entered into an alliance with Oerlikon Esec, a provider of semiconductor assembly equipment. The partnership enables the companies to expand their presence by providing complete manufacturing solutions and services in the rapidly growing IC module business in the smart card industry and related emerging markets.
Muhlbauer and Oerlikon Esec's long time cooperation has now transitioned to a formal alliance, focusing on turnkey solutions for the IC module assembly market. Customers will be able to take advantage of the output and reliability of Oerlikon Esec's die bonder and wire bonder technology with Muhlbauer's worldwide standardized encapsulation and testing technology, embedded in Muhlbauer's system integration expertise and proven turn key solutions. In addition, customers will have access to an enhanced service network and one point of contact for all support needs. Together, customers will benefit from leading edge technology, faster response times, and one stop shopping, resulting in the lowest cost of ownership.
Contact: Muhlbauer,Inc., 725 Middle Ground Blvd., Newport News, VA 23606-2512
757-873-0424 fax: 757-873-0485 E-mail:firstname.lastname@example.org Web:
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