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Koh Young Intros Solder Paste Inspection System
Publication Date: 3/25/2009

Seoul, Korea — Koh Young Technology is unveiling its next generation solder paste inspection (SPI) and process optimization tool, the aSPIre-2 — developed to meet increasing demands for speed and accuracy from electronics manufacturers, and is presented as a significant process optimization tool ...
Manncorp Slashes Prices Intros Rework Systems
Publication Date: 3/25/2009

Willow Grove, PA — Manncorp has substantially lowered prices on two of its best-selling pick-and-place machines. The company is also introducing three rework stations designed to save time and dollars by reclaiming components and assemblies in-house — parts that might have been previously discarded ...
Boundary-Scan Tools from JTAG
Publication Date: 3/25/2009

Stevensville, MD — JTAG Technologies has released the latest round of development and hardware debug tools — JTAG ProVision and Visualizer. ProVision combines advanced automation with the level of control and precision that engineers demand when creating test programs and in-system programming ...
Heraeus Launches New Website for Thick Film Materials
Publication Date: 3/25/2009

West Conshohocken, PA — The Thick Film Materials Division of Heraeus has a new website address ( as part of the company's overall revamping of its internet presence. The new Heraeus corporate website includes expanded product and technology content and improved navigation capabilities ...
Fujipoly: Faster, More Accurate Dispensing
Publication Date: 3/25/2009

Carteret, NJ — Fujipoly America has added a new packaging option for its "form in place" thermal interface compound, SARCON® SPG-15A. The recently introduced 30cc and 50cc pneumatic syringes allow faster and more accurate dispensing of the interface material for high-volume automated applications ...
Goepel Intros Boundary Scan Platform
Publication Date: 3/25/2009

Jena, Germany — Goepel electronic is introducing a series of universal board fixtures for its Boundary Scan hardware platform, Scanflex®. The new generation of fixtures is called Scanflex Board Grabber® and is comprised of three models in different sizes.
SmartSonic: 100 percent Closed-Loop Stencil Cleaner
Publication Date: 3/25/2009

Canoga Park, CA — Smart Sonic is introducing the EnviroGuard 100 percent closed-loop stencil cleaner — the first and only aqueous stencil cleaner able to clean all types of solder paste with a 100 percent closed-loop process — wash and rinse. The company matched the special properties of ...
Electrolube: Conformal Coatings Protect PCBs
Publication Date: 3/25/2009

Swadlincote, UK — Electrolube's Conformal Coating Solutions are designed to protect printed circuit boards and related equipment from their environment. Using a conformal coating will improve and extend the working life of the board and ensure security and reliability of performance.
DEK: Future-Proofed Productivity Advantage
Publication Date: 3/25/2009

Flemington, NJ — The DEK Horizon platform offers a comprehensive array of advanced features as standard, including optimized printer frame technology, motorized stencil alignment, fast product changeover, 2.0 Cpk print process capability and 6-sigma production performance — offering a clear productivity ...
DuPont: APR Copper Clad Resistor Laminate
Publication Date: 3/25/2009

Research Triangle Park, NC — DuPont High Performance Laminates is expanding its portfolio of embedded materials and all-polyimide laminates with the introduction of DuPont Pyralux® APR copper clad resistor laminate for advanced multi-layer flex, rigid flex and rigid printed circuit boards. This patented ...
CSZ Intros Compact Thermal Shock Chambers
Publication Date: 3/25/2009

Cincinnati, OH — Cincinnati Sub-Zero (CSZ) is introducing a new line of vertical thermal shock chambers. These state-of-the-art products reportedly combine high performance, small footprint, and an array of standard features to offer exceptional value. The vertical air-to-air testing chamber uses ...
Christopher Assoc.: Koki Pastes Solve Solder Problems
Publication Date: 3/25/2009

Santa Ana, CA — Christopher Associates Inc. now has available Koki solder solutions to deal with the issue of increased head-in-pillow (BGA) soldering defects primarily related to warpage of the board or BGA/CSP components during reflow soldering. Typically this has occurred more often during lead-free soldering ...
Corelis Expands QA Support Program
Publication Date: 3/25/2009

Cerritos, CA — The Corelis Quality Assurance Department has ramped up support for future product releases by creating an enhanced Quality Assurance Test Platform (QATP) environment for expanded support of Windows XP 64-bit, Windows Vista 32-bit and 64-bit versions. This is to support the growing performance ...
Chemcut: PCB Prototyping and Manufacturing System
Publication Date: 3/25/2009

State College, PA — Chemcut Corporation is introducing the new 2300 Series product line. Based on the company's popular 2315 etcher, the 2300 Series provides a reliable, high performance, compact, easy-to-install platform for the PW board manufacturing, chemical milling and sign and name plate industries ...
Austin American Intros Combo Cleaner/Tester
Publication Date: 3/25/2009

Austin, TX — Austin American Technology Corp. has developed what it describes as the world's first combination cleaner and cleanliness tester for circuit assemblies. The Mega Ion is a portable, closed-loop single-board cleaner with cleanliness verification testing built in. It is designed to ...
Jergens: Mounting System Speeds Accurate Fixture Locking
Publication Date: 3/25/2009

Cleveland, OH — The patented Ball Lock Mounting System from Jergens, Inc. is the practical quick-change system for fixturing in metalworking and metal-forming operations, for either horizontal or vertical machining centers. With the current trend toward smaller production runs, the ability to ...
Ascentech: Solderability Testing
Publication Date: 3/25/2009

Chester, CT — Ascentech is offering the MUST III System — a wetting balance testing system capable of testing to all relevant solder standards including ICE, MIL-STD, IPO/EYE/JADE. The system measures the solderability of a printed circuit board and/or component's metallic terminations by documenting ...
ACE: Auto Optical Alignment for Selective Soldering
Publication Date: 3/25/2009

Spokane Valley, WA — Faster, more precise, more automated selective soldering is what ACE Production Technologies will provide with its new Automated Optical Alignment on all of the company's KISS selective soldering models. According to the company, automated optical alignment brings a significant ...
Acculogic Intros Hi Performance Flying Prober
Publication Date: 3/25/2009

Markham, ON, Canada — Acculogic's Manufacturing Test Systems Division, is unveiling the Flying Scorpion FLS920Dx Flying Probe Tester. The FLS920 adds formidable new capabilities to the already powerful Scorpion Flying Probe Tester. In addition to no-compromise double-sided test capability, variable ...
Pillarhouse Updates Selective Soldering Machine
Publication Date: 2/5/2009

Elk Grove Village, IL — Pillarhouse, continuing on the success of the Jade selective soldering machine, has introduced the MkII system. The redesign of the electronics system has enabled the company to add many new software and hardware features to the Jade, including flash programmable firmware that...
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