Sunday, June 24, 2018
Publication Date: 03/1/2009
Archive >  March 2009 Issue >  Electronic Mfg. Products > 

Enthone Intros Organic Metal-based PWB Finish
West Haven, CT — Enthone Inc., a business of Cookson Electronics, has introduced OrmeSTAR Ultra PWB final finish. The Organic Metal-based, nanofinish® technology consumes approximately 90 percent less energy and creates less waste versus elelectroless nickel/immersion gold (ENIG) and other traditional metallic final finishes. When compared to ENIG, OrmeSTAR Ultra reduces process time by 75 percent.

The finish costs 30 percent less then ENIG, with no "black pad" risk. The versatile process delivers a high efficiency in application and operation throughout the entire supply chain. The new finish provides a halogen-free coating that enables superior lead-free soldering with a surface conductivity comparable to pure gold. Signal transmission outperforms that of ENIG finishes. The nanofinish generates a visible coating that allows for ease of inspection and high first-pass yields with no false failures at in-circuit test. Because there are no intermediate metals present, the solder bonds directly to copper to form the industry's strongest solder joints.

OrmeSTAR Ultra bonds with copper without a displacement reaction, ensuring long bath life, no microvoids, and no solder mask interface attack. The durable coating allows for wipe downs on misprinted assemblies with no copper oxidation.

Hold (dwell) time between thermal cycles is similar to other metal finishes. Application during PWB fabrication can occur before electrical test. Low application temperatures, minimal water usage and long bath life make OrmeSTAR Ultra the most environmentally friendly HASL alternative.

According to the company, the process offers the reliability and easy application of an organic solderability preservative (OSP), with the durability and properties of a metal finish.

Contact: Enthone Inc., P.O. Box 1900, New Haven, CT 06508 203-799-4904 fax: 203-799-1513 Web:

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