Sunday, June 25, 2017
VOLUME -24 NUMBER 5
Publication Date: 05/1/2009
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Archive >  May 2009 Issue >  Front Page News > 
Green Power: Converting Waste Heat

Durham, NC — Generating clean power from waste heat is gaining significant attention worldwide. One way is to use thermoelectric modules to convert the heat energy directly to electricity. There is a direct link between TE module performance, in terms of efficiency, and the applicability of TEs in ...
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NIST to Help Fund Best R&D

Gaithersburg, MD — The National Institute of Standards and Technology (NIST) has set in motion a 2009 competition for multiyear research funding in two major areas of national interest, civil infrastructure and manufacturing, under its Technology Innovation Program (TIP). TIP expects to provide cost-shared ...Read More
Sunburst EMS Building Unique Energy Product

West Bridgewater, MA — You've probably seen them in WW II movies, where patriots in the Philippines or other South Pacific locations behind enemy lines would power a clandestine radio transmitter by pedaling on a bicycle/electric generator. Fast forward more than 60 years and such a machine is now part of something ...Read More


 
 
SV TCL Recognized as a VLSIresearch THE BEST Subsystems Supplier
TEMPE, AZ - SV Probe Pte. Ltd. (“SV TCL”), a leading global supplier of high-performance probe cards and semiconductor test solutions, today announced that VLSIresearch has released a detailed white paper with additional SV TCL results from their 2017 Customer Satisfaction Survey (“CSS”).

Micralyne and Microplex Partner to Deliver Metal "Through Silicon Via" Wafers
EDMONTON, ALBERTA - Micralyne Inc., a leading manufacturer of MicroElectroMechanical Systems (MEMS) and a primary supplier of sensors, is pleased to announce a collaboration with Microplex in Placentia, California to develop and manufacture custom wafers with Metal Through Silicon Via's (TSV). The joint development of this technology leverages the specific expertise of each company to enable a truly flexible and cost effective Metal TSV solution for sensor and semiconductor applications.
 

NFI Corp. (Nameplates For Industry) Announces New Ownership; Hingham resident takes reins of global company
NEW BEDFORD, MA - NFI Corp. (Nameplates For Industry, www.nameplatesforindustry.com), the New Bedford-based global leader in high performing printed graphic solutions, recently announced that the firm has been acquired by Renaud Megard of Hingham, Mass., who now serves as the company’s president and CEO.

SEMI Europe Applauds New Semiconductor Manufacturing Investment
BERLIN, GERMANY - SEMI Europe today commended the announcement of a new electronics manufacturing facility in Dresden, Germany and the supporting public policy to reinvigorate regional innovation. SEMI Europe, the European regional office of the global industry association SEMI, engages SEMI members to advance the global electronics manufacturing supply chain.

 
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