Monday, December 18, 2017
VOLUME -24 NUMBER 5
Publication Date: 05/1/2009
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Archive >  May 2009 Issue >  Front Page News > 
Green Power: Converting Waste Heat

Durham, NC — Generating clean power from waste heat is gaining significant attention worldwide. One way is to use thermoelectric modules to convert the heat energy directly to electricity. There is a direct link between TE module performance, in terms of efficiency, and the applicability of TEs in ...
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NIST to Help Fund Best R&D

Gaithersburg, MD — The National Institute of Standards and Technology (NIST) has set in motion a 2009 competition for multiyear research funding in two major areas of national interest, civil infrastructure and manufacturing, under its Technology Innovation Program (TIP). TIP expects to provide cost-shared ...Read More
Sunburst EMS Building Unique Energy Product

West Bridgewater, MA — You've probably seen them in WW II movies, where patriots in the Philippines or other South Pacific locations behind enemy lines would power a clandestine radio transmitter by pedaling on a bicycle/electric generator. Fast forward more than 60 years and such a machine is now part of something ...Read More


 
 
SEMI: North American Semiconductor Equipment Industry Posts November 2017 Billings
MILPITAS, CA - North America-based manufacturers of semiconductor equipment posted $2.05 billion in billings worldwide in November 2017 (three-month average basis), according to the November Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. 
Avnet Sponsors The Not Impossible Awards Recognizing Emerging Technologies that Improve Lives
Avnet, a leading global technology distributor, today announced its title sponsorship of The Not Impossible Awards, which recognizes the breakthrough achievements of innovators who share the Not Impossible Labs mission to create inventive technology that improves the well-being of others. 
aveni® S.A. Extends Copper Interconnects to 5nm and Below for BEOL Integration Using Innovative Electroplating Chemistry
MASSY, France - aveni S.A., developer and manufacturer of market-disrupting wet deposition technologies and chemistries for 2D interconnects and 3D through silicon via packaging, today announced it has obtained results that strongly support the continued use of copper in the back end of line (BEOL) for advanced interconnects, at and beyond the 5nm technology node. 
Kilopass NVM OTP IP Achieves 3-Lot Qualification on GLOBALFOUNDRIES 14nm LPP (Low Power Process) Process Technology
SAN JOSE, CA - Kilopass Technology Inc., a leading provider of semiconductor logic embedded non-volatile memory (eNVM) intellectual property (IP), today announced that it successfully achieved a three-lot qualification on GLOBALFOUNDRIES (GF) 14nm LPP (Low Power Process) technology platform for its one-time programmable (OTP) NVM technology. 
 
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