Save. Share. Connect.
Saturday, September 24, 2016
VOLUME -24 NUMBER 6
Publication Date: 06/1/2009
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Components and Distribution
Product Preview: Atlantic Design/MDM
June 2009 Issue
Add Message Board
Besi Presents New Subsidiary Esec
Nuremberg, Germany — Besi has been joined by Esec in merger, which results in a new world-class vendor of backend equipment offering a comprehensive portfolio of products and solutions.
As a result of the merger, the Esec business is split into "Die Attach" and "Wire Bonding" entities, joining with Datacon. Esec will concentrate on mainstream and standard die-attach applications, while Datacon focuses its proven strengths in advanced packaging and customized business. Another new discrete product unit within the Besi organization is "Packaging & Plating". It bundles the expertise of Fico and Meco; it also includes Molding, Trim and Form as well as Singulation and Plating. The new, much broader Besi organization now is based on three product units: Die Attach (Esec, Datacon); Packaging and Plating (Fico, Meco); and Wire Bonding (Esec).
Contact: Datacon North America, Inc., 3150 Tremont Avenue, Trevose, PA 19053
215-791-7070 fax: 215-791-7074 E-Mail: firstname.lastname@example.org Web:
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | email@example.com
powered by GIM