Wednesday, December 7, 2016
VOLUME -24 NUMBER 7
Publication Date: 07/1/2009
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Archive >  July 2009 Issue >  Electronic Mfg. Products > 

Henkel Launches Next-Gen Underfill
Highly workable underfill.
Irvine, CA — Henkel has engineered and launched a new underfill system that reportedly fulfills a large array of complex and demanding requirements, including room temperature fast flow, low temperature cure and reworkability.

The new material, Hysol® UF3800, has been specifically designed for use with today's CSP and BGA devices and is particularly well-suited for handheld communications and entertainment applications.

The new underfill flows fast at room temperature and cures quickly at low temperature. There is no need for substrate pre-heat, and when combined with the material's faster flow and low temperature quick curing mechanism, manufacturers have the opportunity to reduce energy costs, eliminate capital equipment expenditure associated with dispensing system heaters, and substantially improve throughput rates.

In addition, the material is reworkable, which improves final yield while allowing assembly houses to maintain environmental responsibility by reducing scrap. Sustainability is also a key component, as it is a halogen-free material that meets the current accepted industry standard of less than 900 parts per million (ppm) chlorine (Cl) and bromine (Br).

One of the more common issues with traditional underfill systems has been underfill/solder paste compatibility with today's lead-free and halogen-free solder formulations. Incompatibility can lead to incomplete underfill cure and, ultimately, device failures. Hysol UF3800, however, is compatible with a variety of lead-free and halogen-free solder pastes, conferring exceptional process flexibility, outstanding performance and in-field reliability. In addition, the special chemistry of the material offers a relatively high glass transition temperature (Tg) — required for improved thermal cycle performance as well as good reworkability — two properties that are normally opposed to each other. In most cases, reworkable materials have a low Tg, which then also lowers the thermal performance. But Hysol UF3800 offers both a high Tg and reworkability.

Adding to the list of benefits, the product also offers stable electrical performance under temperature humidity bias (THB), an essential performance metric as devices continue to get smaller and I/O pitches become tighter.

Contact: Henkel Corp., 15350 Barranca Parkway, Irvine, CA 92618 949-789-2500 E-mail: doug.dixon@us.henkel.com Web:
http://www.henkel.com/electronics

 
 
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