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Tuesday, April 24, 2018
VOLUME -24 NUMBER 7
Publication Date: 07/1/2009
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Assembly and Packaging
Product Preview: Semicon West
July 2009 Issue
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Rogers Intros Airborne Antenna Materials
Laminate supports antenna applications.
Rogers, CT — The Advanced Circuit Materials (ACM) Division of Rogers Corporation has introduced its latest patent-pending innovation in high frequency materials — RT/duroid
The RT/duroid 5880LZ materials reportedly have the lowest Dk for a copper clad laminate available in the market today, providing improved antenna efficiency. It is a lightweight, PTFE-based composite optimized with a special filler that provides very low density (1.37gm/cm
)and a low coefficient of thermal expansion (CTE) in the z-axis. This makes the material well suited for fabricating high-frequency circuits with plated-through holes (PTHs) and allows higher vehicle payloads. With an exceptional TCDK (thermal coefficient of dielectric constant) of 22PPM/°C, the product enables consistent circuit performance and stable dielectric constant versus temperature.
According to the company, the laminate material delivers consistent performance across each board and from panel to panel for critical amplitude- and phase-matched applications. The easy-to-machine material can be supplied as a laminate with a variety of electrodeposited copper weights and with a variety of dielectric thicknesses.
Contact: Rogers Corporation, P.O. Box 188, Rogers, CT 06263-0188
860-774-9605 fax: 860-779-5509 Web:
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