Save. Share. Connect.
Thursday, February 23, 2017
VOLUME -24 NUMBER 7
Publication Date: 07/1/2009
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Assembly and Packaging
Product Preview: Semicon West
July 2009 Issue
Add Message Board
Tamar Provides Non-Destructive TSV Depth Measurement
Wafer etch depth measurement system.
Newbury Park, CA — Tamar Technology's new Wafer Thickness Sensor (WTS) provides a non-destructive solution for measuring deep etch and Through Silicon Via (TSV) depth with unlimited aspect ratios.
The TSV depth measurement performance is being qualified with major IDMs, foundries and equipment suppliers. The WTS measures TSV diameters down to 1µ with unlimited depths, meaning aspect ratio concerns are eliminated.
According to the company, the instrument's measurement capability allows semiconductor manufacturers to qualify their process across the wafer in a timely and cost-effective manner that improves the overall utilization of the etch line. Etch depth uniformity can now be verified in minutes in a non-destructive manner, allowing instant feedback for etch recipe generation."
The instrument's high-speed data rates allow it to be integrated into the Wafer etching tools, improving manufacturing yields and tool utilization by measuring the depth of an etch process immediately after etching. This in-situ measurement capability reportedly gives real time process control where none existed before.
Contact: Tamar Technology, 996 Lawrence Drive, Suite 202, Newbury Park, CA 91320
805-480-3358 E-mail: firstname.lastname@example.org Web:
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | email@example.com
powered by GIM