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Wednesday, August 31, 2016
VOLUME -24 NUMBER 8
Publication Date: 08/1/2009
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Test and Measurement
Product Preview: ATE and IPC Midwest
August 2009 Issue
Front Page News
NIST: Passing the Neutron Science Torch
Gaithersburg, MD — What do the mystery of how proteins fold, the unexpected behavior of nanoparticles, and the key to making hydrogen fuel cells have in common? All can be investigated with beams of slow-moving neutrons — and scientists at the National Institute of Standards and Technology (NIST ...
Printed Electronics Using More Inorganics
By Raghu Das, CEO, IDTechEx, www.IDTechEx.com
Printed electronics is using more inorganics and composites in the quest for higher performance, lower costs, finer feature size, stretchability and creation of radically new components such as memristors, supercabatteries and metamaterials. Here is what some developers and suppliers have been up ...
IEEE Industry Standards: New Program to ID Software
Piscataway, NJ — The IEEE Industry Standards and Technology Organization (ISTO) has established a new program focused on revolutionizing software asset management by effective implementation of standards — TagVault.org.
Industry Veteran Lung Chu Named President of SEMI China
SAN JOSE, CA - SEMI today announced the appointment of Lung Chu as president of
effective September 1, 2016. With the recent broadening ambitions for China’s indigenous semiconductor supply chain, Lung Chu joins
at a critical inflection in the China market. Chu will be instrumental in evolving and repositioning SEMI’s programs, committees, products and services in China to deliver the highest member value in the rapidly changing China semiconductor ecosystem.
IPC Releases Annual Electronics Assembly Industry Quality Benchmark Study
BANNOCKBURN, IL - IPC's
Study of Quality Benchmarks for Electronics Assembly 2016
is now available. The annual study provides valuable benchmarking data to electronics assembly companies interested in comparing quality measurements to industry averages.
The quality control measurements covered by the study include first-pass yields for various test methods in use as well as the percent of products subjected to these tests.
Alpha to Feature Material Set Combinations for Greatest Reliability at SMTA Guadalajara Expo
SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will feature material set combinations to include paste, tacky flux, cored wire and wave soldering flux that are tested with one another to achieve greater reliability at the
SMTA Guadalajara Expo
to be held
October 5th-6th in Guadalajara, Jal. MÉXICO
Indium Corporation Experts to Present at IEMT–EMAP 2016
CLINTON, NY - Indium Corporation experts will deliver several technical presentations at the
37th International Electronics Manufacturing Technology and 18th Electronics Material & Packaging Conference
(IEMT-EMAP 2016), Sept. 20-22, in Penang, Malaysia.
Andy C. Mackie, PhD, MSc
, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will deliver the keynote address, The Future of Power Device Packaging: Materials and Assembly Processes.
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