Tuesday, October 24, 2017
VOLUME -24 NUMBER 8
Publication Date: 08/1/2009
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Archive >  August 2009 Issue >  Front Page News > 
NIST: Passing the Neutron Science Torch

Gaithersburg, MD — What do the mystery of how proteins fold, the unexpected behavior of nanoparticles, and the key to making hydrogen fuel cells have in common? All can be investigated with beams of slow-moving neutrons — and scientists at the National Institute of Standards and Technology (NIST ...
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Printed Electronics Using More Inorganics


Printed electronics is using more inorganics and composites in the quest for higher performance, lower costs, finer feature size, stretchability and creation of radically new components such as memristors, supercabatteries and metamaterials. Here is what some developers and suppliers have been up ...Read More
IEEE Industry Standards: New Program to ID Software

Piscataway, NJ — The IEEE Industry Standards and Technology Organization (ISTO) has established a new program focused on revolutionizing software asset management by effective implementation of standards — TagVault.org. Read More


 
 
European Space Agency approval for Ventec material in Amphenol Invotec rigid & flex-rigid production

Amphenol Invotec, one of Europe’s leading manufacturers of complex printed circuit boards (PCBs), and Ventec International, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, are delighted to announce that Ventec's VT-901 polyimide material is now fully qualified by ESA in Amphenol Invotec’s manufacturing process for rigid and Flex-rigid PCBs.


New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

DELAWARE, OH Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.


 
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