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Tuesday, May 22, 2018
VOLUME -24 NUMBER 8
Publication Date: 08/1/2009
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Test and Measurement
Product Preview: ATE and IPC Midwest
August 2009 Issue
Front Page News
NIST: Passing the Neutron Science Torch
Gaithersburg, MD — What do the mystery of how proteins fold, the unexpected behavior of nanoparticles, and the key to making hydrogen fuel cells have in common? All can be investigated with beams of slow-moving neutrons — and scientists at the National Institute of Standards and Technology (NIST ...
Printed Electronics Using More Inorganics
By Raghu Das, CEO, IDTechEx, www.IDTechEx.com
Printed electronics is using more inorganics and composites in the quest for higher performance, lower costs, finer feature size, stretchability and creation of radically new components such as memristors, supercabatteries and metamaterials. Here is what some developers and suppliers have been up ...
IEEE Industry Standards: New Program to ID Software
Piscataway, NJ — The IEEE Industry Standards and Technology Organization (ISTO) has established a new program focused on revolutionizing software asset management by effective implementation of standards — TagVault.org.
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.
Atotech to present Spherolyte® CU UF3 for fine line RDL at ECTC 2018
BERLIN, GERMANY -
is pleased to announce its partaking in the Electronics Components and Technology Conference (ECTC) 2018. As a gold sponsor, Atotech will participate with two presentations and a booth, highlighting its latest solutions for flexible electronics as well as fan-out wafer-level and fan-out panel-level packaging.
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