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Monday, May 29, 2017
VOLUME -24 NUMBER 9
Publication Date: 09/1/2009
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: PCB and Assembly
Product Preview: ATE and IPC Midwest
September 2009 Issue
Front Page News
Breakthrough May Bring New Gen PC Boards
Syracuse, NY — Circuit boards may get a whole new pedigree and production methodology because of an amazing discovery by PCB veteran Robert Tarzwell working in his laboratory at DMRPCB — literally a cottage industry site. It's the stuff of Silicon Valley garage startups: Tarzwell has made a momentous
discovery that can revolutionize the way printed circuits are fabricated. At the same time, this new ...
New Hydrogen Storage Brings Fuel Cell Autos Closer
Los Alamos, NM — With every announcement of another automobile manufacturer's fuel cell initiative come wonderful pronouncements and forecasts that are still far from being fulfilled for a number of reasons. One of these over-arching stumbling blocks has been the lack of a suitable fuel storage system for pure ...
IPC Study: Industry Gaining Strength
Bannockburn, IL — IPC has released the results of its latest Fast Facts survey, "Survival Strategies and Success Measures in the Electronics Industry". With data from a representative sample of electronics OEMs, EMS companies, PCB manufacturers and suppliers, the survey reveals the strategies companies are ...
SMTA and CALCE Seeking Abstracts for 3rd Annual LED Assembly, Reliability, and Test Symposium
MINNEAPOLIS, MN - The SMTA and CALCE are pleased to announce the LED Assembly, Reliability, and Test (A.R.T.) Symposium will take place November 28 - November 30, 2017 at the Archie K. Davis Conference Center in Research Triangle Park, NC.
Indium Corporation Expert to Present at China Semiconductor Packaging Test Symposium (CSPT) 2017
CLINTON, NY -
’s Leo Hu, Area Technical Manager, will present at the China Semiconductor Packaging Test Symposium (CSPT) on June 21-23 in Jiangyin, China.
SEMI | FlexTech and CPEIA Announce Partnership at CPES2017
MILPITAS, CA - SEMI | FlexTech (
) and the Canadian Printable Electronics Industry Association (
) have signed a Memorandum of Understanding to support each other’s programs and drive the continued development and adoption of printable, flexible hybrid, and wearable electronics (PE and FHE).
Ventec: Thomas Michels to Speak at the EIPC Summer Conference
SUZHOU, CHINA - Ventec's European Managing Director Thomas Michels will speak at EIPC Summer Conference on June 1st & 2nd, 2017 to be held at the Best Western Plus Manor Hotel, Solihull, UK.
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