Monday, December 5, 2016
VOLUME -24 NUMBER 9
Publication Date: 09/1/2009
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Archive >  September 2009 Issue >  Front Page News > 
Breakthrough May Bring New Gen PC Boards

Syracuse, NY — Circuit boards may get a whole new pedigree and production methodology because of an amazing discovery by PCB veteran Robert Tarzwell working in his laboratory at DMRPCB — literally a cottage industry site. It's the stuff of Silicon Valley garage startups: Tarzwell has made a momentous
discovery that can revolutionize the way printed circuits are fabricated. At the same time, this new ... Read More
New Hydrogen Storage Brings Fuel Cell Autos Closer

Los Alamos, NM — With every announcement of another automobile manufacturer's fuel cell initiative come wonderful pronouncements and forecasts that are still far from being fulfilled for a number of reasons. One of these over-arching stumbling blocks has been the lack of a suitable fuel storage system for pure ...Read More
IPC Study: Industry Gaining Strength

Bannockburn, IL — IPC has released the results of its latest Fast Facts survey, "Survival Strategies and Success Measures in the Electronics Industry". With data from a representative sample of electronics OEMs, EMS companies, PCB manufacturers and suppliers, the survey reveals the strategies companies are ...Read More


 
 
Murphy, Choh and Pilla Join ClassOne Technology's Board of Advisors
KALISPELL, MT - ClassOne Technology (www.classone.com), manufacturer of advanced wet processing equipment for ≤200mm substrates announced the formation of a Board of Advisors. This body will be made up of highly-regarded senior executives from the semiconductor industry who will provide their perspective and guidance to ClassOne as it navigates the expansion of its operations.
 

Indium Corporation’s Karch Recognized for Best Presentation at IMAPS Autumn Conference 2016
CLINTON, NY - Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, was recognized for his technical presentation at the IMAPS Autumn Conference in October in Munich, Germany.

Karch was awarded “Best Presentation” for the session New Solder Material Technology in the Manufacturing Process of IGBT Modules, which discussed a new method that produces strong, reliable solder joints that resist cracking and thermal fatigue.

Ventec International Group Focus On High Thermal Performance Materials for Automotive and LED Applications at HKPCA 2016, China
SUZHOU, CHINA - Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, will exhibit in Booth #4B16 at HKPCA, China, scheduled to take place December 7th-9th, 2016 at the Shenzhen Convention & Exhibition Center, China.

 
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