Thursday, July 27, 2017
VOLUME -24 NUMBER 9
Publication Date: 09/1/2009
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Archive >  September 2009 Issue >  Front Page News > 
Breakthrough May Bring New Gen PC Boards

Syracuse, NY — Circuit boards may get a whole new pedigree and production methodology because of an amazing discovery by PCB veteran Robert Tarzwell working in his laboratory at DMRPCB — literally a cottage industry site. It's the stuff of Silicon Valley garage startups: Tarzwell has made a momentous
discovery that can revolutionize the way printed circuits are fabricated. At the same time, this new ... Read More
New Hydrogen Storage Brings Fuel Cell Autos Closer

Los Alamos, NM — With every announcement of another automobile manufacturer's fuel cell initiative come wonderful pronouncements and forecasts that are still far from being fulfilled for a number of reasons. One of these over-arching stumbling blocks has been the lack of a suitable fuel storage system for pure ...Read More
IPC Study: Industry Gaining Strength

Bannockburn, IL — IPC has released the results of its latest Fast Facts survey, "Survival Strategies and Success Measures in the Electronics Industry". With data from a representative sample of electronics OEMs, EMS companies, PCB manufacturers and suppliers, the survey reveals the strategies companies are ...Read More


 
 
International Wafer-Level Packaging Conference (IWLPC) Keynote Presenters Announced
SAN JOSE, CA - The SMTA and Chip Scale Review are pleased to announce the Keynote Presenters for the 14th annual International Wafer-Level Packaging Conference. The IWLPC will be held October 24-26, 2017 at the DoubleTree by Hilton Hotel in San Jose, California.


LUTZE Introduces Teal Ethernet Cat5e Cable
CHARLOTTE, NC - Data transmission is critical for success in today’s manufacturing environment. LUTZE’s new flexible Cat5e AWM 600V Ethernet cable (part#104349) is engineered to protect your data from harmful interference ensuring uninterrupted data transmission and long term network reliability.
 

NXP Announces Production of Security Chips in its US Manufacturing Facilities
AUSTIN, TX; CHANDLER, AZ - NXP Semiconductors N.V. today announced a $22 million dollar program that expands its operations in the United States, enabling the Company’s US facilities to manufacture security chips for government applications that can support critical US national and homeland security programs.
 

 
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