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Tuesday, August 30, 2016
VOLUME -24 NUMBER 9
Publication Date: 09/1/2009
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September 2009 Issue
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Ironwood Intros Hi-Performance BGA Socket
Burnsville, MN — Ironwood Electronics has introduced a high performance BGA socket for 1.0mm pitch BGA. The SG-BGA-8019 socket is designed for a 35mm package size, operates at a bandwidth up to 10GHz with less than 1dB of insertion loss. The sockets are designed to dissipate 16 watts with swivel heat sink lid. The swivel heat sink lid swivels over the shoulder screw which is fixed in the socket body. The contact resistance is typically 20 milliohms per pin.
The socket is constructed with high performance and low inductance elastomer. The temperature range is -40 to +100°C. The pin inductance is 0.15nH. Capacitance to ground is 0.10pF. Current capacity is 2A per pin. The socket accommodates IC packages such as the IDT 35 x 35mm, 1mm pitch FCBGA. Simply attach the socket to the PCB, drop in chip, place and tighten easy install swivel lid with heat sink.
This elastomer socket technology, applicable for BGA pitches from 0.3 to 1.27mm, allows these pitch BGAs to operate to over 10GHz without significant contactor loss.
Contact: Ironwood Electronics, Inc., 11351 Rupp Dr.,Suite 400, Burnsville, MN 55337
800-404-0204 or 952-229-8200 fax: 651-452-8400 E-mail: firstname.lastname@example.org Web:
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