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Posted: March 7, 2016
MAKING OVENS SMARTER
This white paper sets out the anomaly that is the lack of intelligence available in ovens compared to elsewhere on the production line and the clear benefits of making the oven smarter. If you were handing prizes out for intelligence on the shop floor, I suspect the oven wouldn’t get the first prize, yet we have devoted so much time to factory intelligence and the path towards what many are calling the Smart Factory. IoT and big data are colliding to create the opportunity to automate the SMT line, and indeed the rest of the manufacturing processes, in a way that hasn’t been possible before. Terms like Industry 4.0 and IoM (Internet of Manufacturing) are being used to support and to promote the development towards a factory where every machine can play an intelligent role, interacting with the data provided from and to other pieces of equipment. This white paper seeks to set out the value of a ‘smarter’ approach to the reflow process and how a more intelligent oven can offer real added value and performance to the entire line. It also lays out some of the criteria that is important when selecting smart equipment for a smart process, that conforms to, and is ready for, IoM or Industry 4.0.
KIC THERMAL

Posted: February 22, 2016
Wabash Transformer Announces New Input Configuration (415VAC) to our Class 2 Transfomrers
Announcement of new input configuration (415 VAC) to our Class 2 Transformers. Application and benefits included.
Wabash Transformer

Posted: March 2, 2015
Considerations in building board-level functional test systems
This article explores steps to configuring high-volume, high-mix functional test system standardizations along the production line, and how addressing interfacing from the measurement instrument all the way to the device under test I/O pin is a requirement to thoroughness of test and product quality. The article will also present a case example to modularizing board and product level functional test.
Circuit Check Inc.

Posted: February 20, 2015
Latest Material and Construction Methods Provide the Highest Quality Rigid-Flex PCB's
With the demand for portable electronics ever increasing, the need to produce more compact devices with ever-increasing capabilities calls for engineering solutions that combine functionality with flexibility. Rigid-Flex circuits can be shaped to fit where no other design solution can. They are an integrated hybrid of printed circuit board and flex circuit technology and exhibit the benefits of each. This allows substantially greater freedom of packaging geometry and a significant reduction of interconnects while retaining the precision, density and repeatability of printed circuit board technology. Applications of Rigid-Flex circuits can be found throughout the electronics industry and in the most demanding applications including aerospace, medical and military.
Epec Engineered Technologies

Posted: February 20, 2015
Medical Industry White Paper Medical Device Marking: Challenges and Solutions
Marking medical devices can be challenging for medical device manufacturers. Identification tasks become increasingly demanding and the industry's regulations are getting stricter, such as currently shown by the FDA's UDI (Unique Device Identification) directive. However, manufacturers of marking systems and identification solutions take up the various challenges and multifaceted requirements and develop reliable solutions for medical device marking. Solutions that not only ensure the proper marking of all medical products but are also capable of improving medical device producers' process reliability and efficiency.
ALLTEC GmbH | FOBA Laser Marking + Engraving

Posted: February 20, 2015
Laser Marking in the Semiconductor Industry
Economic and cost effective laser marking on surface mount devices.
Alltec GmbH

Posted: February 20, 2015
Quality Check and Inspections in Production Time with the New SMAC Multi-Axis Actuator System XYZ Coordinate Verification Machine
An actuator system that combines all the advantages of our unique SMAC technology. The new SMAC XYZ system is a quality check (QC) development that measures and verifies three dimensional features. We are using modified SMAC actuators and multiple actuator assemblies to set up this multi-axis control solution. Any SMAC actuator can be combined into one system: slide, linear, and rotary/linear units. Specific arrangements of the units deliver the capability to learn and follow a certain 3D contour or motion path. Complex programming is not required as the user can simply manually "trace" the 3D path required by the actuators; it is then automatically stored in the controller's memory, alternatively a comparative check can be made using a reference part. The system also features and utilizes linear interpolation, which enables a constant speed while following the chosen XYZ axis contour. SMAC offers the complete inline gauging solution with a range of flexible control interfaces. The XYZ system relies on the patented SMAC “Soft-land” technology and provides measurements with exceptionally high speed, precision, accuracy and repeatability.
SMAC

Posted: February 20, 2015
Printed Circuit Board Surface Finishes – Advantages and Disadvantages
Anyone involved within the printed circuit board (PCB) industry understand that PCB's have copper finishes on their surface. If they are left unprotected then the copper will oxidize and deteriorate, making the circuit board unusable. The surface finish forms a critical interface between the component and the PCB. The finish has two essential functions, to protect the exposed copper circuitry and to provide a solderable surface when assembling (soldering) the components to the printed circuit board.
Epec Engineered Technologies

Posted: February 5, 2015
The Benefits of Soldering with Vacuum Profiles
Requirements for void-free solder joints are continuously increasing in the field of electronics manufacturing, i.e. the reduction or elimination of cavities in the connection technology used between component connectors and connector pads. New challenges evolve on a daily basis due to the relentless introduction of new variants of so-called bottom terminated components (BTCs), a few of which are shown in figure 1. Connector geometries alone are not decisive – numerous pitfalls are of greater significance. Incentives and several fundamentals will be elucidated in the first part, which will then be supplemented in part 2 with results and perspectives. Figure
REHM THERMAL SYSTEMS

Posted: July 14, 2014
Using Heavy Copper and EXTREME Copper in PCB Design and Fabrication for Maximum Reliability
An increasing number of power electronics products are taking advantage of a growing trend in the printed circuit board industry: Heavy Copper and EXTREME Copper Printed Circuit Boards. Most commercially available PCBs are manufactured for low-voltage/low power applications, with copper traces/planes made up of copper weights ranging from 1/2 oz/ft2 to 3 oz/ft2. A heavy copper circuit is manufactured with copper weights anywhere between 4 oz/ft2 to 20 oz/ft2. Copper weights above 20 oz/ft2 and up to 200 oz/ft2 are also possible and are referred to as EXTREME Copper. Our discussion will focus primarily on Heavy Copper.
Epec Engineered Technologies


                                                                                
 
 
 
 
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