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Sunday, June 24, 2018
VOLUME -24 NUMBER 10
Publication Date: 10/1/2009
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LORD Using DEK Galaxy Platform
Rolling Meadows, IL — Lord Corporation has selected DEK's Galaxy platform for development of its next-generation pre-applied underfill materials. Lord, Cary, NC needs the precision, accuracy and process capability of the Galaxy to enable its materials innovation initiatives.
Pre-applied — also known as wafer-applied — underfill (WAU) systems have garnered much attention. However, to date, few formulations have delivered the performance required to move the process into mainstream semiconductor packaging applications such as wafer-level CSPs and flip-chip technology. Historically, pre-applied underfills have suffered from challenges such as material integrity issues during the wafer dicing process and long-term material stability. LORD Corporation's WAU resolves many of these challenges, offering a material that, among other benefits, exhibits no cracking from dicing stress.
Contact: DEK, 1785 Winnetka Cir., Rolling Meadows, IL 60008
847-368-1155 Web:
http://www.dek.com
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