Sunday, December 4, 2016
VOLUME -24 NUMBER 10
Publication Date: 10/1/2009
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Archive >  October 2009 Issue >  Electronic Mfg. Products > 

ISI Now Certifies Reballed Parts
Reballed parts now certified.
Camarillo, CA — Interconnect Systems, Inc. (ISI) has developed its reballing process to the extent the company can now certify that the silicon is protected to specific parameters throughout the process.

ISI certifies that the parts are protected through the process to IPC/JEDEC J-STD MSL Classification as required by the semiconductor supplier.

The company certifies that the process used for ball removal will protect the silicon, never subjecting it to a time temperature cycle above 50 percent of the supplier's recommended cycle.

ISI certifies that the ball attach process will be performed in a nitrogen environment in a conduction convection oven and will never exceed 90 percent of the time temperature recommended by the supplier.

Finally, the company certifies that the parts have been 100 percent optically inspected to ensure that the device meets the original supplier's specifications for flatness and coplanarity.

The process has proven reliable and affordable, and the company tailors dimensional specifications and processes to each part. Specific control parameters for each phase of handling, production and controls for temperature, humidity, ESD protection, ball size/position tolerance specifications, automation, cleanliness, 100 percent optical inspection and repackaging are rigorously maintained.

Contact: Interconnect Systems, Inc., 759 Flynn Road, Camarillo, CA 93012 805-482-2870 fax: 805-482-8470 Web:
http://www.isipkg.com

 
 
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