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VOLUME -24 NUMBER 12
Publication Date: 12/1/2009
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Dow Intros Polymer Polishing Pads
Low defect polishing pad.
Midland, MI — Dow Electronic Materials has introduced the Optivision
™
4540 CMP Polishing Pad designed to deliver low defects and low cost of ownership over pad lifetime. The new pad is formulated with a special, surfactant-free, polymer chemistry and pore structure to help minimize defects and provide higher dielectric film rates in copper barrier polishing. The new pad has a dual pore structure that accurately controls polishing while providing a consistent polishing surface over the life of the pad.
The pad is available for a variety of applications where traditional soft pads are used. When used for copper barrier polishing, it has demonstrated an order of magnitude improvement in chatter and microscratch defects compared to Politex
™
Pad products, resulting in higher production yields. Tests have shown a 40 percent increase in TEOS removal rate compared to Politex pads, resulting in higher throughput and reduced cost of ownership.
The pad can also be used in conjunction with the company's ACuPLANE
™
5100 Series Slurries for enhanced performance. The pads are available in multiple sizes and configurations, including the latest window options, for current and emerging technology nodes and platforms.
Contact: The Dow Chemical Company, 2030 Dow Center, Midland, MI 48674
989-636-1000 Web:
http://www.dow.com
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