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VOLUME -24 NUMBER 12
Publication Date: 12/1/2009
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Test and Measurement
Product Preview: productronica
December 2009 Issue
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Silicone-Free Thermal Solutions from Electrolube
Silicone-free heat transfer compound.
Kingsbury Park, UK — Electrolube has launched two new thermal management solutions: HTCX and HTCPX. They are both enhanced versions of the well-established products HTC and HTCP. Both new products have improved thermal conductivity, lower oil bleed, and lower evaporation weight loss compared with HTC and HTCP.
Most components have a maximum effective operating temperature. Failure to maintain the temperature below this maximum can lead to increased failure rates and variation of electrical properties. The range of applications incorporating the use of a thermally conductive material has greatly increased as electronic circuits have become smaller, more complex and powerful. These advances have generally resulted in greater heat generation.
Heat generated within components is conventionally removed by the use of metals, either formed to give high surface areas (heatsinks) or to form part of the assembly's outer body. The hot component is mechanically attached to the metal, but invariably there is always an air gap between the surfaces. As air is a poor conductor of heat, this air gap greatly reduces the rate of heat dissipation. The application of HTCX or HTCPX completely fills the gap, excluding air, and providing added conductivity.
The two compounds have been specially formulated by using a proprietary additive to provide a significant increase in thermal conductivity without sacrificing the viscosity/consistency or film thicknesses associated with the original products. The ultimate in thermal conductivity, and other exceptional properties, obtained from HTCPX are also due to the novel use of various metal oxide (ceramic) powders. These two materials are electrically insulative to ensure that leakage currents cannot be formed if the paste should come into contact with other parts of the assembly.
HTCX and HTCPX are recommended where the efficient and reliable thermal coupling of electrical and electronic components is required and between any surface where thermal conductivity or heat dissipation is important. They should be applied to the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicone rectifiers and semiconductors, thermostats, power resistors and radiators. HTCPX can also be used as a thermal conductive gap filler.
The two compounds contain no silicones and cannot migrate onto electrical contacts, and soldering problems caused by silicones will not be encountered.
Contact: Electrolube, Kingsbury Park, Midland Rd., Swadlincote, Derbyshire, DE11 0AN, UK
44 (0) 1283 222111 fax: 44 (0) 1283 550177 E-mail: email@example.com Web:
See at productronica Booth A4.271.
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