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Monday, May 21, 2018
VOLUME -24 NUMBER 12
Publication Date: 12/1/2009
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Test and Measurement
Product Preview: productronica
December 2009 Issue
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Reworkable Underfill from Zymet
Underfill for BGAs.
East Hanover, NJ — Zymet has introduced a new reworkable underfill encapsulant, CN-1728, designed to underfill Package-on-Package (POP) assemblies. Underfilled POPs have greater difficulty in passing thermal cycle tests than underfilled BGAs. Compared to earlier generation underfills, CN-1728 has a lower coefficient of thermal expansion and higher Tg, and better compatibility with flux residues, factors that contribute to its superior thermal cycle performance.
The compound is a fast-flowing capillary underfill with a viscosity of 900 cps, and it can be cured in as little as 1 minute at 150°C. These properties makes it suited for high-volume, high-speed in-line processing.
Rework is accomplished by use of elevated temperature, 170°C to 180°C, to remove the underfill fillet. Then, the BGA is lifted from the board after heating it to reflow temperature. Underfill residue is easily scraped off, again at 170°C to 180°C.
Contact: Zymet, Inc.., 7 Great Meadow Lane East Hanover, NJ 07936
973-428-5245 fax: 973-428-5244 E-mail: firstname.lastname@example.org Web:
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