Monday, October 23, 2017
VOLUME -25 NUMBER 2
Publication Date: 02/1/2010
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Archive >  February 2010 Issue >  Front Page News > 
Micro-Size Si PVs Developed at Sandia

Albuquerque, NM — Almost microscopic in size, tiny photovoltaic cells have been developed by Sandia National Laboratories scientists and may well revolutionize the solar cell industry. The tiny glitter-sized photovoltaics could turn a person into a walking solar battery charger if they were fastened ...
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NIST Demos Programmable Quantum Processor

Gaithersburg, MD — Physicists at the National Institute of Standards and Technology (NIST) have demonstrated the first "universal" programmable quantum information processor able to run any program allowed by quantum mechanics — the rules governing the submicroscopic world — using two quantum bits (qubits ...Read More
German Fuel Cells Charge RV Batteries

Brunnthal, Germany and Middlebury, IN — Fuel cells may be coming to your recreational vehicle soon. Fuel cell battery backup was demonstrated by US RV maker Jayco at the recent 47th Annual National RV Trade Show in Louisville, KY, using a fuel cell from German manufacturer SFC Smart Fuel Cell.Read More


 
 
European Space Agency approval for Ventec material in Amphenol Invotec rigid & flex-rigid production

Amphenol Invotec, one of Europe’s leading manufacturers of complex printed circuit boards (PCBs), and Ventec International, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, are delighted to announce that Ventec's VT-901 polyimide material is now fully qualified by ESA in Amphenol Invotec’s manufacturing process for rigid and Flex-rigid PCBs.


New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

DELAWARE, OH Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.


 
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