Sunday, June 24, 2018
Publication Date: 02/1/2010
Archive >  February 2010 Issue >  Product Preview: Electronics West / MDM > 

Heraeus Intros Dielectric Paste
Dielectric paste provides good thermal specs.
West Conshohocken, PA — The Thick Film Materials Business Unit of Heraeus has developed two new products to improve the efficiency of mounting silicon ICs to aluminum substrates. Working in tandem, this new thick film dielectric and conductor system provides very low thermal resistance between the chip and the heat sink in high power applications such as HB LEDs.

In applications that require significant heat dissipation to prevent damage to the circuit, alumina (Al2O3) becomes an inadequate substrate material due to its low thermal conductivity. Aluminum is a much more attractive alternative due to its high thermal conductivity and low cost. However, the main disadvantage of aluminum is its high coefficient of thermal expansion (CTE) compared to glass insulating layers. This mismatch with the insulating materials can cause significant bowing of the substrate.

The unusual glass system of the new lead- and cadmium-free dielectric paste (IP6075) from Heraeus was developed to offer excellent thermal conductivity on both 3003- and 6061-grade alloy aluminum substrates. The dielectric paste significantly reduces bowing by closely matching the CTE of aluminum, while providing excellent breakdown strength. The company has also developed a new lead-free silver conductor paste (C8829A). The conductor paste, fired together at 550°C with the dielectric paste, provides excellent solderability and adhesion.

This new technology is suitable for applications such as direct-mounted LED arrays that require significant heat dissipation to increase the lighting efficiencies.

Contact: Heraeus, 24 Union Hill Rd., West Conshohocken, PA 19428 610-825-6050 fax: 610-825-7061 Web:

See at Pacific Design/MDM West Booth #2201.

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