Friday, April 20, 2018
VOLUME -25 NUMBER 6
Publication Date: 06/1/2010
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Archive >  June 2010 Issue >  Front Page News > 
June '10: Sandia Upgrades Battery Abuse Testing Lab

Albuquerque, NM — Sandia National Laboratories is receiving and using $4.2 million in American Recovery and Reinvestment Act (stimulus) funds to modify and enhance its existing Battery Abuse Testing Laboratory (BATLab), with the goal of developing low-cost batteries for electric and plug-in hybrid ...
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The Truly Integrated Circuit


For 40 years, integrated circuits have integrated little more than transistors, diodes and sensors onto one piece of silicon, gallium arsenide, or other similar material. Now these circuits are being taken to a different level — where most electrical and electronic components are co-deposited on ...Read More
IPC: Proposed RoHS Revisions Not Needed

Bannockburn, IL — A new report, "Electronics Without Brominated Flame Retardants and PVC — a Market Overview," has been issued by a non-governmental organization (NGO) based in Sweden. IPC - Association Connecting Electronics Industries, is actively refuting statements published in the report. Read More


 
 
EOS WLC550 series offers maximum Cooling Flexibility on Standard Footprint
Last week at the MT-CONNECT in Nuremberg more than 150 companies from the European MedTec Business met for discussing the latest trends and guidelines in MedTec industry. When EOS power presented its medical up to class-2 powersupplies at MT-CONNECT, the EOS team made an exciting observation: While everyone is still talking about the size of the powersupplies, which is still very true for home devices, the real crucial factor for sales support for larger devices at the MT connect was the cooling.   
SMTA Europe announces Session 6 Technical Program on Automotive Electronics at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Eden Prairie, MN - Electronic products may be subjected to thermal excursions resulting from the power on/off cycling and changes in the environment temperature. The board geometry and architecture can affect the thermal-mechanical reliability of the PCB materials. Dr. Eric Cotts from Binghamton University will present on PCB Materials and Fabrication. Dr. Cotts will share his thoughts on designing for excellence.
SEMI and TechSearch International Report Global Semiconductor Packaging Materials Market Reaches $16.7 Billion

MILPITAS, CA SEMI, the industry association representing the global electronics manufacturing supply chain, and TechSearch International today reported that the global semiconductor packaging materials market reached $16.7 billion in 2017. While slower growth of smartphones and personal computers – the industry’s traditional drivers – is reducing material consumption, the slowdown was offset by strong unit growth in the cryptocurrency market in 2017 and early 2018. Flip chip package shipments into the cryptocurrency market, while providing a windfall to many suppliers, are not expected to remain at high levels.  


C&K ANNOUNCES THAT IT HAS ACQUIRED VUILLERMOZ
Newton, MA – C&K, one of the world’s most trusted brands of high-quality electromechanical switches, today announces that it has acquired the company Vuillermoz, a micro-mechanical components and tooling company located in St. Claude, France.



 
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