Save. Share. Connect.
Sunday, May 27, 2018
VOLUME -25 NUMBER 7
Publication Date: 07/1/2010
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Assembly and Packaging
Product Preview: Semicon West
July 2010 Issue
Front Page News
Quantum Computing Gets Closer
By Abby Vogel, Georgia Institute of Technology, Atlanta, GA
Despite a steady improvement in the speed of conventional computers during the last few decades, certain types of problems remain computationally difficult to solve. Quantum computers hold the promise of offering a new route to solving some of these problems, such as breaking encryptions ...
IPC Updates Power Conversion Standard
Bannockburn, IL — IPC - Association Connecting Electronics Industries
has released the "A" revision of IPC-9592, Requirements for Power Conversion Devices for the Computer and Telecommunications Industries. First released in 2008, IPC-9592 sets the requirements for power conversion devices (PCDs) in the ...
Enough Lithium for Everybody
By Walter Salm
The astonishing news that Afghanistan appears to have enormous stores of valuable minerals — especially lithium — has taken the scientific community by surprise.
Indium Corporation to Feature AuSn Solder Preforms at International Microwave Symposium
CLINTON, NY -
will feature its precision AuSn solder preforms at
International Microwave Symposium
(IMS) 2018 from June 10-15 in Philadelphia, Penn.
Indium Corporation’s AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability for joining and sealing.
SEMICON WEST Adds WT | Wearable Technologies Conference Co-Location: Premier U.S. electronics manufacturing event expands with wearables program
MILPITAS, CA - SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco.
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 |
powered by GIM