Sunday, May 27, 2018
VOLUME -25 NUMBER 7
Publication Date: 07/1/2010
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Archive >  July 2010 Issue >  Front Page News > 
Quantum Computing Gets Closer


Despite a steady improvement in the speed of conventional computers during the last few decades, certain types of problems remain computationally difficult to solve. Quantum computers hold the promise of offering a new route to solving some of these problems, such as breaking encryptions ...
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IPC Updates Power Conversion Standard

Bannockburn, IL — IPC - Association Connecting Electronics Industries® has released the "A" revision of IPC-9592, Requirements for Power Conversion Devices for the Computer and Telecommunications Industries. First released in 2008, IPC-9592 sets the requirements for power conversion devices (PCDs) in the ...Read More
Enough Lithium for Everybody


The astonishing news that Afghanistan appears to have enormous stores of valuable minerals — especially lithium — has taken the scientific community by surprise.Read More


 
 
Indium Corporation to Feature AuSn Solder Preforms at International Microwave Symposium
CLINTON, NY - Indium Corporation will feature its precision AuSn solder preforms at International Microwave Symposium (IMS) 2018 from June 10-15 in Philadelphia, Penn.

Indium Corporation’s AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability for joining and sealing.         

SEMICON WEST Adds WT | Wearable Technologies Conference Co-Location: Premier U.S. electronics manufacturing event expands with wearables program
MILPITAS, CA - SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco.         
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.        
 
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