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VOLUME -25 NUMBER 8
Publication Date: 08/1/2010
Front Page News
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Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Test and Measurement
Product Preview: AATE/IPC Midwest
August 2010 Issue
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USB 3.0 Interconnects from Keystone
USB 3.0 plugs and sockets.
Astoria, NY — A new series of advanced Micro-USB plugs and sockets that can handle up to 4.8Gbps data transfer speeds is now available from Keystone Electronics Corp. These sockets reduce PCB footprints and support On-the Go (OTG) technology for mobile device connectivity without a host computer.
Designed for increased durability, the new USB 2.0 and USB 3.0 products can withstand greater than 10,000 mating cycles. Micro configurations provide the smallest PCB footprint of all USB interconnects, significantly reducing needed PCB real estate. In addition, a special socket lead-in design enables blind mating with the plug. Plugs and sockets are manufactured with gold-plated contacts for reliability and low contact resistance.
Cat. No. 940TR is a surface mountable Micro-USB 2.0 Type B socket. It is available on tape-and-reel to simplify pick-and-place installation. Insulating material is UL94V-0 rated. Cat. No. 955 is a thru-hole mountable Micro-USB, 3.0 Type B Socket that delivers data transfer speeds to 4.8Gbps. All USB 3.0 sockets are backward-compatible with USB 2.0 plugs. They are suitable for use in numerous electronic devices such as digital cameras, mobile phones, flash drives and computer peripherals.
Type B Micro-USB Plug kits, Cat. No. 941 for USB 2.0 applications and Cat. No. 957 for USB 3.0 applications, are well suited for creating custom cable assemblies. Kits are supplied with an unassembled metal housing with strain relief.
Contact: Keystone Electronics Corp., 31-07 20th Road, Astoria, NY 11105-2017
800-221-5510 or 718-956-8900 fax: 718-956-9040 E-mail: firstname.lastname@example.org Web:
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