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Tuesday, October 25, 2016
VOLUME -25 NUMBER 9
Publication Date: 09/1/2010
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: PCB and Assembly
Product Preview: AATE/IPC Midwest
September 2010 Issue
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In Rosemont: Workshops, EASi Line, Free Forums Update Attendees
Bannockburn, IL — Industry experts will shine the spotlight on recent revisions to key electronics manufacturing industry standards and guidelines during IPC's professional development program at Electronics Midwest. The show is co-located with five Canon Communications Shows: Medical Design & Manufacturing (MD&M) Midwest, Design & Manufacturing Midwest, Assembly & Automation Technology Expo, PLASTEC Midwest and Green Manufacturing Expo at the Donald E. Stephens Convention Center in Rosemont, Illinois.
On September 27 and September 29-30, half-day, in-depth workshops will address major updates to the standards that establish electronics manufacturing requirements and acceptability criteria worldwide. In addition, a workshop covering industry best practices, new and emerging developments and future trends in materials and processes for packaging and assembly will be offered.
"These workshops offer a great opportunity for attendees to learn about the standards they use or specify regularly and how to maximize operational efficiencies," says Dave Torp, IPC vice president of standards & technology. "As an added bonus, every workshop attendee will receive a copy of the corresponding standard(s)."
On September 27, C. Don Dupriest of Lockheed Martin Missiles and Fire Control will present, "What's New in IPC-A-600H and IPC-6012C." Dupriest will discuss the revisions to IPC-6012C, Qualification and Performance Specification for Rigid Printed Boards, and its companion document, IPC-A-600H, Acceptability of Printed Boards. He will review the new specifications and provide attendees with a thorough understanding of the processes, materials and engineering requirements impacted by the revisions.
In "IPC-7351B Land Pattern: Reliable Footprint and Land Pattern Configuration in a Lead-Free Environment," on September 29, instructors Dieter Bergman, IPC director of technology transfer, and Tom Hausherr, EDA library product manager for Mentor Graphics Corporation, will help attendees get up to date on advances in surface mount land pattern design.
On September 30, the revisions to two key industry standards, J-STD-001, "Requirements for Soldered Electrical and Electronic Assemblies", and IPC-A-610, "Acceptability of Electronic Assemblies", will be reviewed. The morning workshop, "What's New in IPC J-STD-001E?" will cover the requirement changes necessitated by evolving solder technology. Recognized worldwide as the sole industry-consensus standard for soldering processes and materials, J-STD-001 encompasses advanced technologies and provides new and updated criteria for all three classes of construction, as well as expanded support for lead-free manufacturing. The workshop will be taught by the leaders of the IPC J-STD-001 Task Group.
In the afternoon, the co-chair of the IPC-A-610 Task Group will provide an overview of the application and impact of the new requirements of IPC's most widely-used standard in "What's New in IPC-A-610E?" Relevant for anyone responsible for the acceptability of printed circuit assemblies, the session will review criteria for surface mount, soldering connection, wetting, depanelization, flex, mechanical assembly, intrusive soldering and lead-free.
In addition to workshops on standards updates, "Packaging and Assembly in the New Decade — Materials and Processes," will be presented by Jennie Hwang, Ph.D., H-Technologies Group Inc., on September 29. The session will highlight new and emerging developments in solder materials, bare board, modular process and techniques of lead-free and tin-lead assemblies.
EASi Line Demonstration
Each step in the electronics assembly process is on display and fully functioning on the show floor at Electronics Midwest. The Electronics Assembly Suppliers' Initiative (EASi) Line will highlight 12 of the industry's top suppliers, with on-site experts available to talk about the EASi-Line's state-of-the-art processes, materials and equipment. The EASi-Line will run all three days that exhibits are open, in Hall G. of the Donald E. Stephens Convention Center in Rosemont, Illinois.
The EASi-Line enables attendees to follow a product from screen printing to component mounting and then through reflow — all while learning about the design, coordination of technical information and processes, equipment and cleaning systems used to manufacture the assembly. At the end of the line, attendees will receive a finished assembly, courtesy of EASi-Line participants: Aimtron Corporation — EMS services; Freedom CAD Services, Inc. — design services; Bare Board Group, Inc. — printed circuit boards; Topline — components; Microscreen — stencils for solder paste deposition ; On Site Gas Systems — nitrogen gas for lead-free selective solder applications ; Flexlink — laser marker and conveyors; MYDATA automation, Inc. — solder paste printer; JUKI Automation Systems — assembly equipment (pick-and-place); Heller Industries — reflow soldering oven; ACE Production Technologies — through hole selective soldering ; Kyzen Corporation — cleaning chemistries ; Aqueous Technologies Corp. — cleaning equipment; FKN Systek Inc. — depanelizer. "With the uptick in the market, suppliers are excited about showing off the latest technologies and their newest equipment," says Maria Labriola, IPC manager of trade show sales. "Best of all, attendees will be able to view the equipment in action and get their questions answered on the spot. This live demonstration is a great way for attendees to learn how they can enhance their own processes, and be competitive in today's marketplace."
Free Technical Sessions
On Tuesday, September 28, Carol Handwerker, Sc.D., Reinhardt Schuhmann, Jr. professor of materials engineering at Purdue University, will present the opening session, "Designing Electronics for Tomorrow and Manufacturing with Sustainability in Mind." A vital topic for both national and international research activities, sustainability requirements drive behavior within electronics R&D as well as materials choices and manufacturing. As Dr. Handwerker explains, "The economic and environmental dynamics associated with sustainability can make the difference between companies that survive and thrive and those that die." She will share her experiences throughout the electronics industry as well as her extensive knowledge of materials and metallurgy to provide insights and a true understanding of next generation technologies.
IPC has assembled two panels of experts to provide industry members with solutions to common fabrication and assembly problems. In the "Challenges in Printed Board Fabrication," a free forum on September 28, Chris Mahanna, Robisan Laboratory, Inc.; Wendi Boger, DDi; and Nick Koop, CID, Minco Products will discuss challenges involving: via fill, stacked vias and cap plating processes; thermal stress methodologies; and the new requirements set forth in IPC-6012C, Qualification and Performance Specification for Rigid Printed Boards, as well as when rigid-flex printed boards should be used. In addition, the panelists will touch on how tightly a flex circuit can be bent, and lot acceptance and conformance testing.
The Free Forum on September 29 will focus on the "Challenges in Printed Board Assembly Technology." Renowned industry experts Jennie Hwang, Ph.D., H-Technologies Group; Teresa Rowe, AAI Corporation; and Greg Munie, Ph.D., IPC, will answer attendees' questions on electronics assembly issues, including: electronics manufacturing and EMS market trends; emerging interconnect technologies; current assembly issues and remedies; solder paste technology; lead-free solder joint reliability testing and performance; and printed board surface finishes.
Contact: IPC, 3000 Lakeside Drive, Suite 309S, Bannockburn, IL 60015
847-509-9700 fax: 847-509-9798 Web:
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