Sunday, June 24, 2018
Publication Date: 09/1/2010
Archive >  September 2010 Issue >  Electronic Mfg. Products > 

Vitronics Soltec Launches Enhanced Reflow System
Enhanced reflow oven.
Stratham, NH — Vitronics Soltec has introduced its enhanced XPM3i Reflow System, offering improved performance in terms of ease of use, and lower cost of operation. The new XPM3i uses a patented atmosphere re-circulation system that delivers nitrogen savings of up to 50 percent. The system also can be equipped with a new Dual Lane, Dual Speed conveyor option for higher throughput and greater throughput flexibility for the high-mix processing environment. New software features make it even easier to set up and use, with more powerful tools and features, and a friendlier GUI.

The product platform has proven its capability worldwide and established a reputation for superior reliability. Robust design combined with a special heat transfer system consistently deliver benchmark thermal performance, precise process control, and superior value for high production.

The reflow system is also equipped with the new AUTOset fast setup feature, which makes it possible for the manufacturing engineer to accelerate process development by generating a preliminary reflow recipe based on a PCB assembly's physical characteristics. The engineer can then "fine tune" the preliminary recipe if needed. However, 85 percent of the time, the engineer doesn't need to modify the auto-created recipe at all.

Contact: Vitronics Soltec North America, 2 Marin Way, Stratham, NH 03885 603-772-7778 fax: 603-772-9340 Web:

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