Sunday, April 22, 2018
VOLUME -25 NUMBER 12
Publication Date: 12/1/2010
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Archive >  December 2010 Issue >  Front Page News > 
Fuel Cell Cars Shine in Shanghai

Shanghai, China — The recently closed 2010 Shanghai World EXPO, which ran from May 1 through Oct. 31, covered a vast area of 5km2 (1.3mi.2) — a lot of ground to cover on foot, so EXPO management provided a comprehensive people-moving system. Described as the largest world's fair ...
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Optimism Seen for Small Manufacturing Sector

Rockford, IL — A leading manufacturing sector economist sees "beginning stages for some optimism" in the small business community which, in turn, indicate "solid" economic news for many U.S. manufacturers in 2011.Read More
Converting Near-IR Single Photons

Gaithersburg, MD — Researchers at the National Institute of Standards and Technology (NIST) have demonstrated for the first time the conversion of near-infrared 1,300nm wavelength single photons emitted from a true quantum source, a semiconductor quantum dot, to a near-visible wavelength of 710nm. The ability ...Read More


 
 
SMTA Europe's Harsh Environments Conference Session 7 to Focus on Hi-Temp Mats/Fab
SMTA Europe announces Session 7 Technical Program on High Temperature PCB Materials and Fabrication at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.      
EOS WLC550 series offers maximum Cooling Flexibility on Standard Footprint
Last week at the MT-CONNECT in Nuremberg more than 150 companies from the European MedTec Business met for discussing the latest trends and guidelines in MedTec industry. When EOS power presented its medical up to class-2 powersupplies at MT-CONNECT, the EOS team made an exciting observation: While everyone is still talking about the size of the powersupplies, which is still very true for home devices, the real crucial factor for sales support for larger devices at the MT connect was the cooling.   
SEMI and TechSearch International Report Global Semiconductor Packaging Materials Market Reaches $16.7 Billion

MILPITAS, CA SEMI, the industry association representing the global electronics manufacturing supply chain, and TechSearch International today reported that the global semiconductor packaging materials market reached $16.7 billion in 2017. While slower growth of smartphones and personal computers – the industry’s traditional drivers – is reducing material consumption, the slowdown was offset by strong unit growth in the cryptocurrency market in 2017 and early 2018. Flip chip package shipments into the cryptocurrency market, while providing a windfall to many suppliers, are not expected to remain at high levels.  


C&K ANNOUNCES THAT IT HAS ACQUIRED VUILLERMOZ
Newton, MA – C&K, one of the world’s most trusted brands of high-quality electromechanical switches, today announces that it has acquired the company Vuillermoz, a micro-mechanical components and tooling company located in St. Claude, France.



 
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