Tuesday, June 27, 2017
VOLUME -26 NUMBER 2
Publication Date: 02/1/2011
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Archive >  February 2011 Issue >  Front Page News > 
Extending Moore's Law with Epitaxial Graphene


Move over silicon. There's a new electronic material in town, and it goes fast. That material, the focus of the 2010 Nobel Prize in physics, is graphene — a fancy name for extremely thin layers of ordinary carbon atoms arranged in a "chicken-wire" lattice. These layers, sometimes, just a single atom thick, conduct electricity with virtually no resistance, very little heat generation — and less power consumption than silicon.

With silicon device fabrication approaching its physical limits, many researchers believe graphene can provide a new platform material that would allow the semiconductor industry to continue the march ...
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IEEE Cites Potential for Spin-Based Technology

Piscataway, NJ — According to research reported in the special issue update of Proceedings of the IEEE ( http://www.ieee.org/proceedings) on Nanoelectronics ...Read More
NEMA Publishes New Magnet Wire Standard

Rosslyn, VA — The National Electrical Manufacturers Association (NEMA) has published ANSI/NEMA MW 1000-2008 Revision 2-2010 Magnet Wire. MW 1000, produced by NEMA's Magnet Wire Section, is the premier standards publication for general requirements, product specifications, and test procedures for magnet wire ...Read More


 
 
SV TCL Recognized as a VLSIresearch THE BEST Subsystems Supplier
TEMPE, AZ - SV Probe Pte. Ltd. (“SV TCL”), a leading global supplier of high-performance probe cards and semiconductor test solutions, today announced that VLSIresearch has released a detailed white paper with additional SV TCL results from their 2017 Customer Satisfaction Survey (“CSS”).

Micralyne and Microplex Partner to Deliver Metal "Through Silicon Via" Wafers
EDMONTON, ALBERTA - Micralyne Inc., a leading manufacturer of MicroElectroMechanical Systems (MEMS) and a primary supplier of sensors, is pleased to announce a collaboration with Microplex in Placentia, California to develop and manufacture custom wafers with Metal Through Silicon Via's (TSV). The joint development of this technology leverages the specific expertise of each company to enable a truly flexible and cost effective Metal TSV solution for sensor and semiconductor applications.
 

NFI Corp. (Nameplates For Industry) Announces New Ownership; Hingham resident takes reins of global company
NEW BEDFORD, MA - NFI Corp. (Nameplates For Industry, www.nameplatesforindustry.com), the New Bedford-based global leader in high performing printed graphic solutions, recently announced that the firm has been acquired by Renaud Megard of Hingham, Mass., who now serves as the company’s president and CEO.

 
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