Monday, October 23, 2017
VOLUME -26 NUMBER 4
Publication Date: 04/1/2011
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Archive >  April 2011 Issue >  Front Page News > 
New Solar Cell Self-Repairs


West Lafayette, IN — Researchers are creating a new type of solar cell designed to self-repair like natural photosynthetic systems in plants by using carbon nanotubes and DNA, an approach aimed at increasing service life and reducing cost.
 
"We've created artificial photosystems using optical nanomaterials to harvest solar energy that is converted to electrical power," ...
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WWVH Goes Green with Solar

Barking Sands Naval Base, Hawaii — The NIST radio station in Hawaii, WWVH, has recently received a green upgrade for its power source. The sun is now a significant power source for the National Institute of Standards and Technology (NIST) radio station, which broadcasts time of day, marine storm warnings, and ...Read More
First IPC Standard on Intellectual Property Protection

Bannockburn, IL — IPC has released IPC-1071, "Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing", to assist printed board manufacturers in the development of requirements for the protection of intellectual property (IP) for their customers in commercial, industrial ...Read More


 
 
European Space Agency approval for Ventec material in Amphenol Invotec rigid & flex-rigid production

Amphenol Invotec, one of Europe’s leading manufacturers of complex printed circuit boards (PCBs), and Ventec International, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, are delighted to announce that Ventec's VT-901 polyimide material is now fully qualified by ESA in Amphenol Invotec’s manufacturing process for rigid and Flex-rigid PCBs.


New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

DELAWARE, OH Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.


 
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