Save. Share. Connect.
Sunday, February 19, 2017
VOLUME -26 NUMBER 4
Publication Date: 04/1/2011
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Assembly and Packaging
Product Preview: APEX
April 2011 Issue
Add Message Board
SMTA Int'l Conference on Soldering and Reliability in Toronto
Minneapolis, MN — SMTA's 2011 International Conference on Soldering and Reliability is being held May 3-6 at the Crowne Plaza Toronto Airport Hotel in Toronto, Ontario, Canada, and will be co-located with the SMTA Lead-Free Academy & SMTA Toronto Expo.
Technical conference speakers will represent IBM Corporation, Celestica, Nihon Superior, Binghamton University, Ryerson University, University of Toronto, CALCE, and many other companies and schools. Irene Sterian, Celestica, Inc., will deliver the featured Keynote Presentation "Alternative Energy Sources and What It Means to the Electronics Industry" on Thursday, May 5. The SMTA Lead-Free Academy, Tuesday, May 3, will present half-day tutorials: "2nd Generation Lead Free Alloys: Is SAC the Best We Can Do?"; "Solder Joint Reliability — Failure Mode and Root Cause Analyses (Fatigue, Brittle Fracture, ENIG)"; "High Reliability: Solving Problems with Reliability in the Lead-Free Era"; "Solder Joint Reliability — Acceleration Models, Accelerated Reliability Tests and Screening Procedures".
Best of Conference
The Annual Pan Pacific Microelectronics Symposium & Exhibition that took place January 18-20, 2011, at the Hapuna Beach Prince Hotel, on the Big Island of Hawaii, was well received by attendees from North America, Asia, and Europe. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world.
SMTA reported that attendance increased 20 percent over last year. As rated by the attendees, the Best of Conference Award was presented to Joseph Fjelstad, Verdant Electronics, for his paper titled, "Past, Present and Future of Solderless Assembly." In his paper, Joe examined some of the different solderless assembly methods proposed or used over the years by the electronics industry and took a look forward at some future solutions.
Technical papers from all sessions are currently featured in the 2011 Pan Pacific Symposium Proceedings available in the SMTA Bookstore at
Contact: SMTA, 5200 Willson Rd., Suite 215, Edina, MN 55424 952-920-7682 fax: 952-926-1819 Web:
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | firstname.lastname@example.org
powered by GIM