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VOLUME -26 NUMBER 4
Publication Date: 04/1/2011
Front Page News
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Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Assembly and Packaging
Product Preview: APEX
April 2011 Issue
Electronic Mfg. Products
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Powerful Software for GE phoenix Hi-Res X-ray
X-ray system gets powerful new software.
Wunstorf, Germany — The new x|act inspection software from GE's Inspection Technologies business is now available for the company's phoenix microme|x and nanome|x 180kV high-resolution X-ray inspection systems. This powerful new imaging package replaces the existing phoenix quality|assurance software and finds application in manual inspection of electronic components as well as fully automated, CAD-based, X-ray inspection of solder joints in electronic assemblies.
According to the company, the x|act software is available in three versions: x|act base, x|act operator, and x|act pro. All versions offer easier operation than previous packages, allowing more reliable inspection. Simple macro recording permits intuitive programming of inspection tasks in terms of position and imaging parameters, with all display settings saved with just one mouse click. Automatically created sample maps can be used for all PCBs of the same type anywhere in the system, even when rotated and flipped, and automatic image enhancement improves live images to ensure greater precision of defect detection.
Additional software features included in the x|act operator upgrade package include the facility to introduce a live CAD data overlay, automated saving of results, images and X-ray sample maps and CAD-based programming. The pad IDs can be viewed in the live image as an overlay at any time and from any viewing angle. This always enables quick and precise solder joint mapping even with manual inspection.
In addition to all the features of the first two versions, users who upgrade to x|act pro can enjoy CAD-based image processing as well as statistical review based on inspection results and 3D auto-referencing for optimized positioning accuracy to a few micrometers. To keep programming time to a minimum, x|act operator and x|act pro import the CAD data of the PCB and create a model, which facilitates navigation and also enables inspection strategies to be assigned to the individual components to be inspected. Within x|act pro's library are inspection strategies with all of the information required for automatic inspection for many common solder joint types. After the inspection strategies have been assigned, the views required and inspection program are generated automatically. With CAD-based programming, all of the programming steps can be performed offline at a separate workstation, meaning that the inspection system is not blocked during programming. It also means that programs can be transferred to every x|act-capable phoenix|x-ray system.
phoenix nanome|x and microme|x X-ray inspection systems have an open 180kV, 15- or 20Watt nanofocus or microfocus X-ray tube and the option of the company's unusual temperature stabilized DXR detector technology, which ensures brilliant live inspection images at 30 frames per second. 3D computed tomography (CT) scans of small electronic devices are also a possible option for advanced 3D failure analysis tasks.
Contact: phoenix|x-ray, GE Sensing & Inspection Technologies GmbH, Niels-Bohr-Str. 7, D-31515 Wunstorf, Germany
+49 5031 172-0 E-mail: firstname.lastname@example.org
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