Sunday, December 4, 2016
VOLUME -26 NUMBER 5
Publication Date: 05/1/2011
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Archive >  May 2011 Issue >  Front Page News > 
Giving UAVs High Power, Wide Bandwidth


In the late 1950s, the U.S. Air Force began planning critical missions for reconnaissance without putting military personnel in the line of fire. That marked the beginning of the era of unmanned aerial vehicles (UAVs). Today, the Air Force has a fleet of 250 UAVs, with USAF Chief of ...
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IPC Back to Schaumburg, ATE to McCormick


Chicago, IL — In a move that is sure to cause confusion, disharmony, cancellations, and undue cost overruns, Canon Communications has decided to move its multi-headed Midwest extravaganza from Rosemont's Stephens Convention Center to Chicago's McCormick Place for the September 2011 event. This ...Read More
NIST: Smart Grid Standard Gets Closer

Gaithersburg, MD — Is a "smart" electric grid finally going to become a reality? It's beginning to look that way, since the governing board of the public-private Smart Grid Interoperability Panel (SGIP) has voted in favor of a new standard and a set of guidelines — standards that have been much needed and ...Read More


 
 
Murphy, Choh and Pilla Join ClassOne Technology's Board of Advisors
KALISPELL, MT - ClassOne Technology (www.classone.com), manufacturer of advanced wet processing equipment for ≤200mm substrates announced the formation of a Board of Advisors. This body will be made up of highly-regarded senior executives from the semiconductor industry who will provide their perspective and guidance to ClassOne as it navigates the expansion of its operations.
 

Indium Corporation’s Karch Recognized for Best Presentation at IMAPS Autumn Conference 2016
CLINTON, NY - Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, was recognized for his technical presentation at the IMAPS Autumn Conference in October in Munich, Germany.

Karch was awarded “Best Presentation” for the session New Solder Material Technology in the Manufacturing Process of IGBT Modules, which discussed a new method that produces strong, reliable solder joints that resist cracking and thermal fatigue.

Ventec International Group Focus On High Thermal Performance Materials for Automotive and LED Applications at HKPCA 2016, China
SUZHOU, CHINA - Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, will exhibit in Booth #4B16 at HKPCA, China, scheduled to take place December 7th-9th, 2016 at the Shenzhen Convention & Exhibition Center, China.

 
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