Sunday, April 22, 2018
VOLUME -26 NUMBER 5
Publication Date: 05/1/2011
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Archive >  May 2011 Issue >  Front Page News > 
Giving UAVs High Power, Wide Bandwidth


In the late 1950s, the U.S. Air Force began planning critical missions for reconnaissance without putting military personnel in the line of fire. That marked the beginning of the era of unmanned aerial vehicles (UAVs). Today, the Air Force has a fleet of 250 UAVs, with USAF Chief of ...
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IPC Back to Schaumburg, ATE to McCormick


Chicago, IL — In a move that is sure to cause confusion, disharmony, cancellations, and undue cost overruns, Canon Communications has decided to move its multi-headed Midwest extravaganza from Rosemont's Stephens Convention Center to Chicago's McCormick Place for the September 2011 event. This ...Read More
NIST: Smart Grid Standard Gets Closer

Gaithersburg, MD — Is a "smart" electric grid finally going to become a reality? It's beginning to look that way, since the governing board of the public-private Smart Grid Interoperability Panel (SGIP) has voted in favor of a new standard and a set of guidelines — standards that have been much needed and ...Read More


 
 
SMTA Europe's Harsh Environments Conference Session 7 to Focus on Hi-Temp Mats/Fab
SMTA Europe announces Session 7 Technical Program on High Temperature PCB Materials and Fabrication at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.      
EOS WLC550 series offers maximum Cooling Flexibility on Standard Footprint
Last week at the MT-CONNECT in Nuremberg more than 150 companies from the European MedTec Business met for discussing the latest trends and guidelines in MedTec industry. When EOS power presented its medical up to class-2 powersupplies at MT-CONNECT, the EOS team made an exciting observation: While everyone is still talking about the size of the powersupplies, which is still very true for home devices, the real crucial factor for sales support for larger devices at the MT connect was the cooling.   
SEMI and TechSearch International Report Global Semiconductor Packaging Materials Market Reaches $16.7 Billion

MILPITAS, CA SEMI, the industry association representing the global electronics manufacturing supply chain, and TechSearch International today reported that the global semiconductor packaging materials market reached $16.7 billion in 2017. While slower growth of smartphones and personal computers – the industry’s traditional drivers – is reducing material consumption, the slowdown was offset by strong unit growth in the cryptocurrency market in 2017 and early 2018. Flip chip package shipments into the cryptocurrency market, while providing a windfall to many suppliers, are not expected to remain at high levels.  


C&K ANNOUNCES THAT IT HAS ACQUIRED VUILLERMOZ
Newton, MA – C&K, one of the world’s most trusted brands of high-quality electromechanical switches, today announces that it has acquired the company Vuillermoz, a micro-mechanical components and tooling company located in St. Claude, France.



 
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