Save. Share. Connect.
Thursday, September 21, 2017
VOLUME -26 NUMBER 5
Publication Date: 05/1/2011
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Components and Distribution
Product Preview: EDS
May 2011 Issue
Electronic Mfg. Products
Add Message Board
ERSA: New Mobile Solder Joint Inspection
Optical inspection heads.
Wertheim, Germany — ERSA's ERSASCOPE was the first inspection system to visually inspect hidden solder joints in electronics production without destroying them. Today it is well-established worldwide. At SMT 2011 in Nuremberg, the company will be introducing its new ERSA mobileSCOPE, which is a compact video microscope for mobile use, wherever it is needed. Like the patented original, the mobileSCOPE is equipped with different optical systems for various application areas. Together with the ImageDoc inspection software it is said to provide outstanding inspection results.
The new product has been designed for optical inspection and digital image recording including measurements of solder joints on BGA, µBGA, CSP and Flip-Chip packages. Further applications are top-view inspection of PCB lands, solder paste prints or in general the optical inspection of components on printed circuit boards in SMT or in Through-Hole Technology (THT) boards. The device can be used in quality control, production, laboratories or R&D departments. The compact ERSA mobile scope connects to a PC or any portable computer through its USB interface and is ready for operation within minutes in any location. By means of the high-quality BGA optical head, components with hidden solder joints can easily be inspected, the Macro-Zoom lens allows top-view surface inspection in various magnifications.
Both optical heads are plugged onto the high-resolution digital color camera hand piece with a "Quick Snap" connection. Changing the optical heads in accordance to the inspection task is a matter of seconds. Long-life and very bright, controllable LED lights are integrated in both optical heads and provide optimal illumination of the solder joints.
In BGA inspection, an additional LED brush light is essential for backlight illumination or to light up hidden and hard-to-reach areas to detect soldering errors quickly and easily. The established ImageDoc inspection software is included, and not only displays the live images, but also offers the operator various possibilities for documentation and inspection and results analyses.
Extensive accessories allow the operator to "build" an individual mobile scope inspection system according to immediate needs. The practical aluminum case offers safe storage of the inspection items and transportation of the system to any location wherever it is needed.
Contact: ERSA NA, 1779 Pilgrim Rd., Plymouth, WI 53073
920-893-1779 E-mail: firstname.lastname@example.org Web:
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | email@example.com
powered by GIM