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Sunday, October 23, 2016
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Nordson DAGE Intros Pad Cratering Inspection System
Pad cratering inspection system.
Aylesbury, UK — Nordson DAGE, has introduced the 4000Plus pad cratering inspection system. The company has developed an unusual patented technique for attaching a test probe to solder bumps or solder paste in order to perform a hot bump pull test in full accordance with the recently published IPC-9708 test standards for the detection of pad cratering for surface mount and printed circuit board assemblies.
Pad cratering has become a major issue with lead-free assemblies and the development of the IPC-9708 standard together with the availability of the 4000Plus hot bump pull test methodology enables product developers to determine the optimum materials for their applications.
The new system's hot bump pull application is achieved by selecting a specialized load cartridge which can be programmed to apply a time-temperature reflow profile to individual solder bumps and/or bonds using a test probe. Reflow parameters including pre-heating, soak, rate of rise, time above liquidous as well as cooling rate are integrated into the system's Paragon
software for easy on-screen profiling and control. A selection of standard probe sizes is offered as well as custom test tips which are available upon request.
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