Thursday, May 24, 2018
VOLUME -26 NUMBER 6
Publication Date: 06/1/2011
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Archive >  June 2011 Issue >  Front Page News > 
Safely Testing Plutonium at Sandia

Albuquerque, NM — Researchers from Sandia and Los Alamos National Laboratories have completed their second experiment in the past six months at Sandia's "Z" machine to explore the properties of plutonium materials under extreme pressures and temperatures — according to the National Nuclear Security ...
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NIST's New Gas Detector Chirps Before Sniffing

Gaithersburg, MD — Trace gas detection, the ability to detect a scant quantity of a particular molecule — a whiff of formaldehyde or a hint of acetone — in a vast sea of others, underlies many important applications, from medical tests to air pollution detectors to bomb sniffers. Now, a sensor that was recently ...Read More
33% of PCBs for US Military Made Offshore

Bannockburn, IL — In an absolutely shocking revelation, the IPC has disclosed that fully one-third of PC boards used by our military are manufactured outside North America. This practice flies in the face of ordinary security prudence, not to mention the lost domestic manufacturing business.Read More


 
 
Indium Corporation Expert to Present at PCIM Europe
CLINTON, NY - Indium Corporation expert, Karthik Vijay, Technical Manager, Europe, Africa, and the Middle East, will present at PCIM Europe on Wednesday, June 6, in Nuremberg, Germany.

Vijay will present Improve Reliability and Bondline Control with InFORMS® and Indalloy®276.
 

SEMICON WEST Adds WT | Wearable Technologies Conference Co-Location: Premier U.S. electronics manufacturing event expands with wearables program
MILPITAS, CA - SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco.         
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.        
Atotech to present Spherolyte® CU UF3 for fine line RDL at ECTC 2018
BERLIN, GERMANY - Atotech is pleased to announce its partaking in the Electronics Components and Technology Conference (ECTC) 2018. As a gold sponsor, Atotech will participate with two presentations and a booth, highlighting its latest solutions for flexible electronics as well as fan-out wafer-level and fan-out panel-level packaging.    
 
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