Monday, October 23, 2017
VOLUME -26 NUMBER 6
Publication Date: 06/1/2011
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Archive >  June 2011 Issue >  Front Page News > 
Safely Testing Plutonium at Sandia

Albuquerque, NM — Researchers from Sandia and Los Alamos National Laboratories have completed their second experiment in the past six months at Sandia's "Z" machine to explore the properties of plutonium materials under extreme pressures and temperatures — according to the National Nuclear Security ...
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NIST's New Gas Detector Chirps Before Sniffing

Gaithersburg, MD — Trace gas detection, the ability to detect a scant quantity of a particular molecule — a whiff of formaldehyde or a hint of acetone — in a vast sea of others, underlies many important applications, from medical tests to air pollution detectors to bomb sniffers. Now, a sensor that was recently ...Read More
33% of PCBs for US Military Made Offshore

Bannockburn, IL — In an absolutely shocking revelation, the IPC has disclosed that fully one-third of PC boards used by our military are manufactured outside North America. This practice flies in the face of ordinary security prudence, not to mention the lost domestic manufacturing business.Read More


 
 
European Space Agency approval for Ventec material in Amphenol Invotec rigid & flex-rigid production

Amphenol Invotec, one of Europe’s leading manufacturers of complex printed circuit boards (PCBs), and Ventec International, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, are delighted to announce that Ventec's VT-901 polyimide material is now fully qualified by ESA in Amphenol Invotec’s manufacturing process for rigid and Flex-rigid PCBs.


New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

DELAWARE, OH Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.


 
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