Saturday, December 10, 2016
VOLUME -26 NUMBER 6
Publication Date: 06/1/2011
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Archive >  June 2011 Issue >  Electronic Mfg. Products > 

Hesse & Knipps Launches Wire Bonding Video Demos on Web
Website videos show wire bonding close up.
San Jose, CA — Hesse & Knipps Semiconductor Equipment GmbH has recently launched its new wire bonding demonstration website at
http://www.wirebonddemo.com. The new website presents more than two dozen videos demonstrating various thin wire wedge bonding, ribbon bonding and heavy wire bonding technologies.

According to the company, the new website enables the company to easily demonstrate the latest wire bonding technologies to equipment users around the world, with a closer view than an operator would get standing in front of the equipment. Plans call for adding more videos that showcase new technologies, such as copper wire bonding, as they move to the forefront of the back-end semiconductor packaging market.

Contact: Hesse & Knipps, Inc., 2305 Paragon Dr., San Jose, CA 95131 408-436-9300 fax: 408-436-2822 E-Mail: info@hesse-knipps.us Web:
http://www.hesse-knipps.com

 
 
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