Tuesday, May 22, 2018
VOLUME -26 NUMBER 7
Publication Date: 07/1/2011
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Archive >  July 2011 Issue >  Front Page News > 
Google Partners with SolarCity to Fund Residential Solar Projects

San Mateo and Mountain View, CA — SolarCity and Google have created a new $280 million fund to finance residential solar projects. The Google-backed fund is the first collaboration between the Internet giant and the nation's leading solar power and energy efficiency service provider, and represents Google's largest investment to date in the clean energy sector.

The fund is SolarCity's largest project financing fund and the largest residential solar fund created in the U.S. SolarCity has now created 15 project funds with seven
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NIST, AIP Make Semiconductor Research Freely Available Online

Gaithersburg, MD — A wealth of information on recent advances in semiconductor research is now available free of charge, following an agreement between the National Institute of Standards and Technology (NIST) and the American Institute of Physics (AIP). The development should be welcome news to semiconductor ...Read More
Sandia & TUV Rheinland to Help US Photovoltaics

Albuquerque, NM — Testing techniques from Sandia National Laboratories are helping accelerate the growth of the nation's photovoltaic solar power industry through a partnership with TUV Rheinland PTL, LLC, a private testing and certification company in Tucson, Arizona.Read More


 
 
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.        
Atotech to present Spherolyte® CU UF3 for fine line RDL at ECTC 2018
BERLIN, GERMANY - Atotech is pleased to announce its partaking in the Electronics Components and Technology Conference (ECTC) 2018. As a gold sponsor, Atotech will participate with two presentations and a booth, highlighting its latest solutions for flexible electronics as well as fan-out wafer-level and fan-out panel-level packaging.    
 
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