|High-throughput inspection system.
Wetzlar, Germany — Leica Microsystems has launched a new line of products that meet the requirements for inspection, process control and defect analysis of wafers in the semiconductor industry — the Leica DM8000 M and the Leica DM12000 M for 8- or 12-in. (200 or 300mm) wafers, respectively.
Contact: Leica Microsystems, 2345 Waukegan Road, Bannockburn, IL 60015 847-405-7062 fax: 847-405-0164 Web:
The integrated macro mode of the Leica DM8000 M and DM12000 M optical inspection microscopes provides up to four times the field of view of conventional scanning objectives. Thus the entire scan area can be accurately checked for possible defects.
The LED illumination is integrated into the stand of both instruments. Without a lamp housing to get in the way, there is an optimal airflow around the microscope. Another advantage of the power LEDs is their extremely long lifetime and low power consumption, making them both economical and more environmentally-friendly. In addition to the visible light, the optional i-line UV illumination is also LED-based.
The new oblique UV mode combines oblique illumination with i-line UV light, enabling fast and easy viewing of the sample from all sides, in 3D and in ultrahigh resolution.