Sunday, June 26, 2016
VOLUME -26 NUMBER 8
Publication Date: 08/1/2011
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ARCHIVE >  August 2011 Issue >  Electronic Mfg. Products > 
Multitest: Dura®Kelvin Reduces Overall Cost of Test

Rosenheim, Germany — Multitest Dura®Kelvin contactors again have proven their reputation for outstanding lifetime and cleaning cycles. At an international IDM's high-volume production site, the contactor substantially contributed to reducing the overall cost of test.
NI: Revolutionary Free PCB Design Software

San Diego, CA — Numerical Innovations (NI) has released its new product — DFM Now!, which allows PCB designers and engineers to verify that their Gerber and Drill files are ready for PCB manufacturing. It also facilitates PCB Quotation and has many other high-end CAM features only found in software costing ...
Nordson ASYMTEK Intros Wafer Dispensing Workcell

Carlsbad, CA — Nordson ASYMTEK is introducing its new automated workcell for film-frame wafer-level packaging applications. The workcell is especially suitable for customers who want to buy their dispensing and handling equipment from a single vendor and are looking for a lower cost-of-ownership ...
Olympus-ITA Intros 3DIR Metrology System

San Jose, CA — Olympus Integrated Technologies America, Inc. (Olympus-ITA) has introduced its latest 3DIR Metrology and Defect Review System. The system uses confocal IR laser scanning microscopy technology for measuring post-bond parameters of three-dimensionally stacked integrated circuits (3DS ...
Practical Components: New Test & Qualification Kit

Los Alamitos, CA — Practical Components Inc. has introduced the new Practical Components TMV® (Through Mold Via) 14mm Board Drop Test Lead-Free Kit is now available. The kit is designed for the 14mm Amkor TMV component.
Q Corp.: Pick & Place Taping System

Derby, KS — Q Corporation now has available the FANUC M-1iA robot with integrated taping cell. The taping cell robot has an unusual six-axis delta style pick-and-place to accommodate difficult-to-pick parts and secondary processes and inspections prior to placing the part in the tape. In addition ...
SEHO Modular Selective Soldering

Kreuzwertheim, Germany — SEHO's SelectiveLine soldering module implements a modular system concept for miniwave soldering that may be adapted to changing production conditions at any time.
Smart Sonic Upgrades Stencil Cleaner

Canoga Park, CA — Smart Sonic, makers of the only EPA Verified Stencil Cleaning Process, has improved the performance of its EnviroGuard closed-loop stencil cleaner by more than 50 percent — achieved by additional refinement of the DI filter media and incorporation of larger filters at no ...
SolderLab.com Debuts PotWatch Service

San Diego, CA — Solderlab.com, an independent solder analysis lab, has introduced PotWatch, an easy-to-use Web-based service that provides users with a scheduled method for testing, tracking and validating solder pot alloy purity.
Sonoscan Intros High-End Lab Acoustic Microscope System

Elk Grove Village, IL — Sonoscan has introduced the Gen6 C-SAM® acoustic micro imaging system. The Gen6 incorporates new and upgraded capabilities building on its well-known predecessor, the Gen5. While the Gen6 maintains the highly-praised look of the Gen5, the electronics and operating ...
Speedprint Launches Screen Printer

Tampa, FL — Speedprint, part of the Blakell Europlacer Group, has introduced the Speedprint SP700avi Screen Printer to the North American market. The new unit combines the company's commitment to high performance and reliability.
Techcon Systems Debuts New Product Catalog

Garden Grove, CA — Techcon Systems, a product group of OK International, has released its updated product catalog. The new catalog highlights the TS5540-MS Micro-Spray Valve, designed to spray low- to medium-viscosity fluids through disposable dispensing tips. The valve uses a field-replaceable UHMWPE ...

Virtual Industries Debuts Anti-ESD Air Ionizers

Colorado Springs, CO — Virtual Industries, Inc. is introducing its VIR-STAT line of air ionizers for eliminating static charges in ESD-sensitive assembly areas.
 
 
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